Conference Session

Continuing Professional Development Division (CPD) Poster Session

Collection

2023 ASEE Annual Conference & Exposition

Authors

Jennifer S Linvill, Purdue University; Eric Holloway, Purdue University at West Lafayette (COE); Emily M. Haluschak, Purdue University at West Lafayette (COE); Evelyn Shana Marx; Breejha Sene Quezada, Purdue University at West Lafayette (PPI); Tamara J Moore, Purdue University at West Lafayette (COE)

Tagged Topics

Diversity

Tagged Divisions

Continuing Professional Development Division (CPD)

the DIB and meetings with content-area experts led to the discoveryof five technical areas and nine non-technical professional skills that are highly desired in entry-level microelectronics engineers. The five technical areas include Radiation Hardening, System-On-Chip, Heterogeneous Integration and Advanced Packaging, Supply Chain, and Trusted AI.These technical areas represent high-need pathways and gaps in the existing microelectronicsworkforce. Additionally, nine professional skills were documented, including communication;diversity, equity, and inclusion; engineering habits of mind; leadership; lifelong learning; multi-disciplinary problem solving; professional and ethical responsibility; teamwork; andunderstanding solutions, impacts