Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Kelli Paul, Indiana University-Bloomington; Lauren Penney, Indiana University-Bloomington; Adam Maltese, Indiana University-Bloomington; Amber Simpson, State University of New York at Binghamton; Jungsun Kim, Indiana University-Bloomington
Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Catherine Wagner, University of Notre Dame; Gina Navoa Svarovsky, University of Notre Dame; Mia Lettau, University of Notre Dame; Kimberly Marfo; Andrea Lorena Ortiz, Pontificia Universidad Católica de Chile; Delaney Ryan; Scott A. Pattison; Smirla Ramos-Montañez; Viviana López Burgos; Sabrina De Los Santos Rodríguez; Maria D. Quijano; Amy R Corbett
Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Jubie Tan, State University of New York at Binghamton; Amber Simpson, State University of New York at Binghamton; Peter N. Knox, University of Vermont; Sawsan Werfelli, State University of New York at Binghamton; Adam Maltese, Indiana University-Bloomington
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Geling Xu, Tufts Center for Engineering Education and Outreach; Milan Dahal, Tufts Center for Engineering Education and Outreach; Brian Gravel, Tufts University
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Alvin Talmadge Hughes IV, University of Florida; Jacob Casey Yarick, University of Florida; Nancy Ruzycki, University of Florida; Hajymyrat Serdarovich Geldimuradov, University of Florida; Sarah Louise Langham, University of Florida; Katherine Miller, University of Florida
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
S. Shailja, University of California, Santa Barbara; Satish Kumar, University of California, Santa Barbara; Arthur Caetano, University of California, Santa Barbara; Ayush Pandey, University of California, Merced
Duff's Dynamic Duo: Harnessing the Power of Teamwork for STEM Excellence!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Cristina Diordieva, Nanyang Technological University; Adeel Khalid, Kennesaw State University; Sohini Gupta, Wheeler High School; Ibrahim H. Yeter, Nanyang Technological University
Duff's Dynamic Duo: Harnessing the Power of Teamwork for STEM Excellence!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Joshua D. Carl, Milwaukee School of Engineering; Amii LaPointe, Milwaukee School of Engineering; Cindy Miller, Milwaukee School of Engineering; Cory J. Prust, Milwaukee School of Engineering; Elizabeth Taylor, Milwaukee School of Engineering
Meltem Alemdar, Georgia Institute of Technology; Dyanne Baptiste Porter, Georgia Institute of Technology; Abeera P. Rehmat, Georgia Institute of Technology; Michael Helms; Alexandra A. Towner, Georgia Institute of Technology; Roxanne Moore, Georgia Institute of Technology; Jeffrey H Rosen, Georgia Institute of Technology; Julia Varnedoe; Marc Weissburg
Christine M Cunningham, Pennsylvania State University; Gregory John Kelly, Pennsylvania State University; Ashwin Krishnan Mohan, Pennsylvania State University
Azizi Penn, Purdue University; Rachel E. Gehr, Purdue University at West Lafayette (PPI); Hillary E. Merzdorf, Texas A&M University; Siddika Selcen Guzey, Purdue University at West Lafayette (COE); Morgan M Hynes, Purdue University at West Lafayette (COE); Kerrie A Douglas, Purdue University at West Lafayette (COE); Tamara J Moore, Purdue University at West Lafayette (COE)
Emanuel Joseph Louime; Eunice Yujin Kang; Emma Anderson, Massachusetts Institute of Technology; Kristin A Searle, Utah State University; Avneet Hira, Boston College
Elizabeth Meintel, University of Cincinnati; Samieh Askarian Khanamani, University of Cincinnati; Blaire MH Bartish M.Ed., University of Cincinnati; Whitney Gaskins, University of Cincinnati; Kyle Turner, University of Cincinnati
Jose Capa Salinas, Purdue University; Manuel Salmeron, Purdue University; Gaurav Chobe, Purdue University; Herta Montoya, Purdue University at West Lafayette (COE); Morgan R Broberg, Purdue University at West Lafayette (COE)
Meltem Alemdar, Georgia Institute of Technology; Sunni Haag Newton, Georgia Institute of Technology; Jessica D Gale, Georgia Institute of Technology; Talia Capozzoli Kessler, Georgia Institute of Technology; Roxanne Moore, Georgia Institute of Technology
Tristan Robert Straight, Wartburg College; Jennah Meyer, Wartburg College; Ibukun Samuel Osunbunmi, Utah State University - Engineering Education; Bolaji Ruth Bamidele, Utah State University; Murad Musa Mahmoud, Wartburg College; Kurt Henry Becker, Utah State University - Engineering Education; Jonathan D. Phillips, Utah State University
Destiny J. Crawford, New Mexico Tech Mechanical Engineering Department; Jett C. Emms, New Mexico Institute of Mining and Technology; Raechelle Sandoval; Curtis John O'Malley, New Mexico Institute of Mining and Technology
Matthew Aldeman, Illinois State University; Jeritt Williams, Illinois State University; Allison Antink-Meyer, Illinois State University; Jin Ho Jo; Maria Luisa Zamudio
Michael R. Odell, University of Texas at Tyler; Li Feng, Texas State University; Christopher Thomas, The University of Texas at Tyler; Eric Stocks; Patrick Massey, Michigan State University
Tanja L. Greene, E.S. Witchger School of Engineering, Marian University; Hansika I. Sirikumara, E.S. Witchger School of Engineering, Marian University Indianapolis, IN; Binh Q. Tran, Marian University