Conference Session

Multidisciplinary Capstone Design

Collection

2014 ASEE Annual Conference & Exposition

Authors

Adam Kaplan, California State University, Northridge; James Flynn, California State University, Northridge; Sharlene Katz P.E., California State University, Northridge

Tagged Divisions

Multidisciplinary Engineering

subtle difficulties of certain tasks.Such discussion amounted to a collaborative design of each component of the software, andallowed large tasks to be decomposed into subtasks by the entire team.F. Software Development EnvironmentThe CubeSat processor is a Microchip dsPIC33 microcontroller. This processor is found inMicrochip’s Explorer16 Development Board (five of which were shared between the softwareteam and the other engineers on the CubeSat project) as well as the Pumpkin CubeSat Kit™Development Board (one of which was shared by project members). The Microchip MPLAB XIDE was used in concert with the Microchip XC16 C Compiler. Hardware debugging wasperformed with a Microchip ICD 3 in-circuit debugger. Subversion was used as our source

Conference Session

FPD 7: Beyond Course Content

Collection

2014 ASEE Annual Conference & Exposition

Authors

Susan F Freeman, Northeastern University; Beverly Kris Jaeger, Northeastern University; Richard Whalen, Northeastern University

Tagged Divisions

First-Year Programs

similar list of elements in the responses, which are explained in thesenext paragraphs. The Minor Design project is hands-on, small team, design-and-build,accomplished early in the term, with a short assignment window of approximately 2-3 weeks.There are different Minor Design projects across the sections taught by various instructors–design and build an alternative energy vehicle to meet criteria, build a pasta bridge to hold amaximum load, design a device to protect a pumpkin from a 50-foot freefall, or develop amodular custom aircraft engine support stand. The Major Design project is conducted in groups Page 24.880.6of 3 to 4, and over a

Conference Session

Laboratory Experiences with Mechanical, Materials and Fluid Systems

Collection

2014 ASEE Annual Conference & Exposition

Authors

Nebojsa I. Jaksic, Colorado State University, Pueblo

Tagged Divisions

Division Experimentation & Lab-Oriented Studies

PLA 3.12 0.15 20 mm Cube on UP!3D ABS 5.03 0.24 Pumpkin ABS 29.13 1.40 Tension Test Specimen ABS 7.23 0.35 Tension Test Specimen PLA 9.25 0.44 Saturn Rocket ABS 60.26 2.89 Snowman ABS 27.87 1.34 Yoda ABS 37.78 1.81 Lamp ABS 74.33 3.57 Ghost (big) Glow-in- 42.81