Conference Session

College Industry Partnerships Division Technical Session 3

Collection

2019 ASEE Annual Conference & Exposition

Authors

Mehmet Çelik, Aselsan Inc., Council of Higher Education of Turkey

Tagged Divisions

College Industry Partnerships

university to find a training program in financialservices technology and infrastructure for the benefit of the region [6]. IBM and ETH ZurichUniversity also have a long collaboration history; University of Zurich providing humanresources training required by technology roadmap of IBM. In the laboratory which wasfounded with the support of IBM, both IBM and the University of Zurich had continued theirresearch activities [7].Developed in partnership with Worchester Polytechnic Institute and BAE Systems, threegraduate programs aiming to train the talent and workforce to meet the needs of the companywere opened [8]. Likewise, San Jose University’s collaboration with KLA-Tencor for thegraduate program in optoelectronics [9] and the National Institute of

Conference Session

College Industry Partnerships Division Technical Session 1

Collection

2019 ASEE Annual Conference & Exposition

Authors

Gregory Scott Duncan, Valparaiso University; Jeffrey Will, Valparaiso University; Ruth E. H. Wertz, Valparaiso University; Tom Cath, Valparaiso University

Tagged Topics

Diversity

Tagged Divisions

College Industry Partnerships

of Illinois at Urbana- Champaign and has been a full-time faculty member in the Electrical and Computer Engineering De- partment at Valparaiso University since August of 2001. He teaches courses in senior design, computer architecture, digital signal processing, freshman topics, and circuits laboratories and is heavily involved in working with students in undergraduate research. Will is also a 2013 recipient of the Illinois-Indiana ASEE Section Outstanding Teacher Award. Upon coming to Valparaiso University, Will established the Scientific Visualization Laboratory (SVL), a facility dedicated to the use of Virtual Reality (VR) for un- dergraduate education. Working exclusively with undergraduate students, Will

Conference Session

College Industry Partnerships Division Technical Session 1

Collection

2019 ASEE Annual Conference & Exposition

Authors

Jennifer Melanie Bastiaan, Kettering University; Diane L. Peters, Kettering University; Juan R. Pimentel, Kettering University; Mehrdad Zadeh, Kettering University

Tagged Divisions

College Industry Partnerships

2007 he received the ”Distinguished Researcher Award” from Kettering Uni- versity for contributions in the area of industrial communication systems and automotive systems. During the last few years he has been involved with wireless sensor networks (WSNs), telemetry systems using tv white spaces, software define radios (SDR), and platforms for deploying IoT technologies.Dr. Mehrdad Zadeh, Kettering University Dr. Zadeh is an associate professor and an advisor of AutoDrive ChallengeTM competition at Kettering University, MI. From Sept. 2015 to January 2017, he served as a visiting associate professor at Johns Hop- kins University, Laboratory for Computational Sensing + Robotics (LCSR), MD, where he collaborates on

Conference Session

College-Industry Partnerships Division Technical Session 2

Collection

2019 ASEE Annual Conference & Exposition

Authors

Faye R. Jones, Florida State University; Marcia A. Mardis, Florida A&M University/Florida State University; Divya Pahuja, Florida State University

Tagged Divisions

College Industry Partnerships

design formanufacturing and assembly (DFMA). Other examples included the ability to create new stencildesigns and familiarity with schematics and technical drawings. Employees were sought withthe ability to design and implement manufacturing processes, instrumentation and equipmentfrom laboratories through pilot planning and to appropriate manufacturing scales. This includedthe ability to improve designs for product realization, field services, and sales. Job postings alsoindicated the need to create printed circuit board design solutions for embedded computersystems, where skill with high component density, high pin count devices, and high layer countdesigns were the norm, as well as designing for electromagnetic capability (EMC