Asee peer logo

A Multidisciplinary Collaborative Model Project Emphasizing Elements From Electrical Engineering, Mechanical Engineering, And Science Majors

Download Paper |


2009 Annual Conference & Exposition


Austin, Texas

Publication Date

June 14, 2009

Start Date

June 14, 2009

End Date

June 17, 2009



Conference Session

Multidisciplinary Design Constituents

Tagged Division

Multidisciplinary Engineering

Page Count


Page Numbers

14.66.1 - 14.66.8



Permanent URL

Download Count


Request a correction

Paper Authors

author page

Maher Rizkalla Indiana University-Purdue University, Indianapolis

Download Paper |

NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

A Multidisciplinary Collaborative Model Project Emphasizing Elements from Electrical Engineering, Mechanical Engineering, and Science Majors

Matt Rubin1, Tyson Fish, Luke Thomas, Maher Rizkalla, and Hasan Akay2 Department of Electrical and Computer Engineering at IUPUI

1. Business Development Manager Indiana University Research & Technology Corporation 351 West Tenth Street Indianapolis, IN 46202

2. Department of Mechanical Engineering at IUPUI 723W Michigan Street Indianapolis, IN 46202

Abstract: The multidisciplinary activities within the MURI (Multidisciplinary Undergraduate Research Initiative) program conducted at IUPUI campus require departmental and school collaboration from across the campus. A research project model is described here to emphasize research elements from physics, electrical and computer engineering, and mechanical engineering that addresses issues related to thermal sciences, physics, solid state devices, CAD, and energy conversion—all combined in one project. The project proposes a new methodology to optimize compound semiconductor thermal and electrical properties optimized for high speed operation and properly interfaced across the composite device layers. The mathematical model incorporating the differential equations with boundary conditions across various interfaces was developed. The paper details the research plan, methodology, and the findings of the project. This model was chosen to build on pre-requisite materials covered in ECE, ME, and Physics curricula such as thermal sciences, semiconductor devices, solid state physics, electromagnetics, CAD, and mathematical simulation tools. The results obtained during one semester have proved the hypothesis of the project leading to optimum performance of metallic semiconductor interface with high speed exciton carrier conversion efficiency within the compound

Rizkalla, M. (2009, June), A Multidisciplinary Collaborative Model Project Emphasizing Elements From Electrical Engineering, Mechanical Engineering, And Science Majors Paper presented at 2009 Annual Conference & Exposition, Austin, Texas. 10.18260/1-2--4710

ASEE holds the copyright on this document. It may be read by the public free of charge. Authors may archive their work on personal websites or in institutional repositories with the following citation: © 2009 American Society for Engineering Education. Other scholars may excerpt or quote from these materials with the same citation. When excerpting or quoting from Conference Proceedings, authors should, in addition to noting the ASEE copyright, list all the original authors and their institutions and name the host city of the conference. - Last updated April 1, 2015