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A Multidisciplinary Electronic Manufacturing Undergraduate Laboratory For The Design And Manufacture Of Dsp And Computer Based Asic Systems

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1999 Annual Conference


Charlotte, North Carolina

Publication Date

June 20, 1999

Start Date

June 20, 1999

End Date

June 23, 1999



Page Count


Page Numbers

4.23.1 - 4.23.7

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Paper Authors

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Maher E. Rizkalla

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Charles F. Yokomoto

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Zina Ben Miled

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Paul Salama

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Mohamed El-sharkawy

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NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Session 1526

A Multidisciplinary Electronic Manufacturing Undergraduate Laboratory for the Design and Manufacture of DSP and Computer Based ASIC Systems

Maher E. Rizkalla, Charles F. Yokomoto, Zina Ben Miled, Paul Salama, and Mohamed El-Sharkawy Department of Electrical Engineering Purdue School of Engineering and Technology Indiana University Purdue University Indianapolis 723W Michigan Street Indianapolis, IN 46202 Tel. No. (317)274-9719


In 1995, we received a NSF ILI grant to develop a one-credit laboratory component for our three- credit lecture course on electronic manufacturing aspects of printed circuit boards [1-3]. In this paper, we describe how we have been able to increase the utilization of the equipment from its original intended use. We do this by developing two additional one-credit laboratory courses for two lecture courses using the laboratory that was set up with the grant. The two new laboratory components will give students experience in the electronic manufacturing aspects of application specific integrated circuit (ASIC) design for digital signal processing (DSP) and computer engineering applications. This will require minimal modification to the existing hardware and software.

The manufacturing aspects of DSP applications focus on incorporating the benefits of high speed hardware circuitry to handle real time decoding and post-processing of video signals. The manufacturing aspects of computer engineering focus on the implementation of special purpose hardware for solving a stiff system of coupled non-linear differential equations. Field programmable gate arrays (FPGAs) will be used for technology implementation. The reconfigurable feature of FPGAs will be exploited to overcome parameter sensitivity and provide the performance needed by adequately customizing the hardware to the solution algorithm.

In addition to describing the details of the two new laboratory courses, the paper will present the results of our continuing efforts to assess student satisfaction of the PCB/ASIC design laboratory as well as our progress in the two laboratory components.

I. Introduction

With the continued and rapid increase of computer and electronic equipment usage, electronic manufacturing has become a significant sector in the manufacturing industry. Electronic production worldwide is undergoing a revolutionary change in both component manufacturing and manufacturing techniques used in chip and board technologies. These new technologies have reduced component size and costs, and have improved the reliability of electronic products. Advancing the state-of-the-art in electronic manufacturing technology presents a challenge to U.S. electronics manufacturers in the highly competitive world of the 90s.

Rizkalla, M. E., & Yokomoto, C. F., & Miled, Z. B., & Salama, P., & El-sharkawy, M. (1999, June), A Multidisciplinary Electronic Manufacturing Undergraduate Laboratory For The Design And Manufacture Of Dsp And Computer Based Asic Systems Paper presented at 1999 Annual Conference, Charlotte, North Carolina.

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