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A Multinational Master's Degree Program in Electronic Product Engineering

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Conference

2012 ASEE International Forum

Location

San Antonio, Texas

Publication Date

June 9, 2012

Start Date

June 9, 2012

End Date

June 10, 2012

Conference Session

International Forum Poster Session & Welcome Reception: Sponsored by Quanser and Cypress Semiconductors

Tagged Topic

ASEE International Forum

Page Count

4

Page Numbers

17.2.1 - 17.2.4

DOI

10.18260/1-2--17024

Permanent URL

https://peer.asee.org/17024

Download Count

510

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Paper Authors

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Helmuth Gesch University of Applied Sciences Landshut, Germany

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Education:
1975 Master of Engineering from Technical University of Munich
1978 Doctorate in Physics from Technical University of Munich

Academic positions and administrative responsibilities:
Professor (since 1985), University of Applied Sciences Landshut, Germany
Vice President (since 2005), responsible for technology transfer and industry related collaborations
Coordinator of the Microelectronic study program
Coordinator of the Industrial Engineering and Management study program (temporarily)
Coordinator of different international cooperation programs mainly in East Asia
Coordinator of the Electronic Product Engineering program
Founder of the Micro System Technology Cluster
Project manager for several industry related projects
Member of the Faculty Council (temporarily)
Member of the University Senate
Member of the University Executive Board

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biography

Richard O Gale Texas Tech University

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Richard Gale is Professor and Associate Chair, Graduate Studies, in the Department of Electrical and Computer Engineering at Texas Tech University. Dr. Gale holds degrees in Physics from the University of California, Berkeley, and Lehigh University. He began his career in academics at Texas Tech in 2002 following a successful career with Texas Instruments 1984-2001. He is a licensed professional engineer in the state of Texas.

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Tanja Karp Texas Tech University

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Nanna Suryana Herman

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Abstract

Abstract prepared for the Inaugural ASEE International Forum A Multinational Master's Degree Program in Electronic Product Engineering Submitted by Prof. Dr. Helmuth Gesch, University of Applied Sciences (UAS) Landshut, Germany Prof. Dr. Richard Gale, Texas Tech University (TTU) Lubbock,TX Prof. Dr. Tanja Karp, Texas Tech University (TTU) Lubbock,TXBackground and MotivationSeveral countries in South East Asia are in the process of transformation from a productionbased economy into a knowledge-based society. This leads to a vast demand and requirementwith respect to education and training at the university level.Multinational companies (MNCs) operate manufacturing facilities in countries like Malaysia,Thailand, and Vietnam. Besides mere manufacturing these companies also aim at innovativeand applied research and development (R&D). While the transfer from manufacturing to runningthe entire production (including e.g. quality management and testing) is desired, a pitfallherewith lies in the suboptimal (local) supply of engineering graduates trained at the highestlevel.Recognizing and tackling this challenge, a consortium consisting of Texas Tech University andthe University of Applied Sciences Landshut (Germany) in conjunction with the Malaysianpartner Universiti Teknikal Malaysia Melaka, MNCs with local production sites, and localcompanies respectively are developing an unparalleled Master’s Degree Program (with best-practice potential) in ‘Electronic Product Engineering’.The companies and universities involved anticipate a vast demand for engineers whoseeducation is based on the high standards provided by US and German universities. The focus ofthe new program will be application oriented and driven by industry needs (rather than basicresearch) which represents the value proposition of this consortium. The aforementionedconsortium is also currently working on developing Ph.D. programs in Malaysia (and Thailand).Methods usedElectronic Product Engineering (EPE) is an executive postgraduate Master's program taught inEnglish. It is designed, executed, and managed by the consortium mentioned above. Thestudent body is international and mainly recruits itself from nationals of South East Asiancountries (mainly Malaysia) as well as US and German nationals. Students or their employersare required to pay tuition fees making the program self-supporting.The program is tailored as an executive program with admittance requirements as follows: • a bachelors degree in electrical engineering or a related field • minimum of one year practical experience • sabbatical leave from their employer during term period • students/employees are anticipated to return to their employer after completing the program of studiesCurriculum: • electronic and system engineering • technology and production methods • quality and testing • customer relations • intercultural competence • project managementDidactics: • active rather than passive pedagogy • team teaching • laboratory tutorials • blended-learningEducational objectives: • train engineering graduates to the highest international level • train the next generation of university lecturers to the highest international level • promote their personal development in order to contribute to the focal country’s developmentResults, Conclusion, SignificanceThe EPE program will be promoted and partly supported by German, US and Malaysiancompanies in international trainee programs. The general course structure is aligned withindustry partners on their needs and attuned with HR managers and CEO's of electroniccompanies.Successful students will be awarded the academic degree of Master's of Engineering-EPE,which leads to a higher education level for engineers in US and German companies who havesubsidiary companies in MalaysiaKeywords:Electronic product engineering, multinational, Malaysia, South East Asia, train the teachers,executive master

Gesch, H., & Gale, R. O., & Karp, T., & Herman, N. S. (2012, June), A Multinational Master's Degree Program in Electronic Product Engineering Paper presented at 2012 ASEE International Forum, San Antonio, Texas. 10.18260/1-2--17024

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