Thomas, M. B., & Mitofsky, A., & Jovanovic, V. M., & Eiler, J. (2014, June), A Third-Year Review of Design and Packaging for Sensor Systems  Paper presented at 2014 ASEE Annual Conference & Exposition, Indianapolis, Indiana. 10.18260/1-2--20014

\bibitem{asee_peer_20014}
  Thomas, M. B., \& Mitofsky, A., \& Jovanovic, V. M., \& Eiler, J. (2014, June), \emph{A Third-Year Review of Design and Packaging for Sensor Systems}
  Paper presented at 2014 ASEE Annual Conference \& Exposition, Indianapolis, Indiana.
  10.18260/1-2--20014

M.  Brian Thomas, Andrea Mitofsky, Vukica M. Jovanovic, and John Eiler.  "A Third-Year Review of Design and Packaging for Sensor Systems".  2014 ASEE Annual Conference & Exposition, Indianapolis, Indiana, 2014, June.  ASEE Conferences, 2014.  https://peer.asee.org/20014 Internet.  07 Jan, 2025

\bibitem{asee_peer_20014}
  M.  Brian Thomas, Andrea Mitofsky, Vukica M. Jovanovic, and John Eiler.
  "A Third-Year Review of Design and Packaging for Sensor Systems".
  \emph{2014 ASEE Annual Conference \& Exposition, Indianapolis, Indiana, 2014, June}.
  ASEE Conferences, 2014.
  https://peer.asee.org/20014 Internet.  07 Jan, 2025

@INPROCEEDINGS{asee_peer_20014
author = "M.  Brian Thomas, Andrea Mitofsky, Vukica M. Jovanovic, and John Eiler"
title = "A Third-Year Review of Design and Packaging for Sensor Systems"
booktitle = "2014 ASEE Annual Conference \& Exposition"
year = "2014"
month = "June"
address = "Indianapolis, Indiana"
publisher = "ASEE Conferences"
note = {https://peer.asee.org/20014}
number = {10.18260/1-2--20014}
}

TY  - CPAPER
AB  -               A THIRD‐YEAR REVIEW OF DESIGN AND PACKAGING OF SENSOR SYSTEMS   Faculty from the Electrical Engineering (EE) and Engineering Technology (ET) Departments at Maguire* University have developed an interdisciplinary module for an upper‐level class in their respective disciplines.  In this module, student teams collaborate in designing and prototyping of electronics and packaging for a hand‐held sensor.  The principal objective of this collaboration is for students to incorporate design factors, external to their discipline, in a program‐focused design project.  This advances the students’ abilities to work effectively in multidisciplinary teams during their senior capstone courses, and their future careers as engineers and technologists.  The design module was introduced in the fall 2011 semester at Maguire, and has been repeated in fall 2013 and fall 2013.  This paper presents assessment data from the fall 2013 semester on the immediate efficacy of the project.  It also discusses survey results from former participants currently enrolled in their senior capstone course, or graduated and working in industry.  *    a pseudonym 
AU  - M.  Brian Thomas
AU  - Andrea Mitofsky
AU  - Vukica M. Jovanovic
AU  - John Eiler
CY  - Indianapolis, Indiana
DA  - 2014/06/15
PB  - ASEE Conferences
TI  - A Third-Year Review of Design and Packaging for Sensor Systems
UR  - https://peer.asee.org/20014
DO  - 10.18260/1-2--20014
ER  -