Wei Lin, North Dakota State University; G. Padmanabhan, North Dakota State University; Robert Pieri, North Dakota State University; Floyd Patterson, North Dakota State University
Karen Crosby, Southern University; Samuel Ibekwe, Southern University; Guoqiang Li, Southern University; Su-Seng Pang, Louisiana State University-Baton Rouge; Kun Lian, Center for Advanced Microstructures and Devices (CAMD)