Roman Taraban, Texas Tech University; Alberto Giussani, Texas Tech University; William M. Marcy P.E., Texas Tech University; Paul A. Terrell, Texas Tech University; Sweta Saraff, IHR Kolkata; Ramakrishna Biswal, Department of Humanities and Social Sciences, National Institute Technology, Rourkela
Breanna Kilgore; Luis Carlos Estrada Petrocelli, Universidad Latina de Panamá, Facultad de Ingeniería; Jay Molino, Univesidad Especializada de las Américas; Ernesto Antonio Ibarra Ramirez P.E., Universidad Latina de Panama; ABHISHEK MAHESH APPAJI, B.M.S. College of Engineering; Rogelio Garcia Contreras, University of Arkansas; Raj R. Rao, University of Arkansas
Systems Engineering Division (SYS) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Amy Thompson, University of Connecticut; Matthew D. Stuber, University of Connecticut; Song Han, University of Connecticut; Abhishek Dutta, University of Connecticut; Hongyi Xu, University of Connecticut; Shengli Zhou, University of Connecticut; Qian Yang, University of Connecticut; Fei Miao, University of Connecticut; George M. Bollas, University of Connecticut
Adel Alhalawani, Rose-Hulman Institute of Technology; Renee D. Rogge, Rose-Hulman Institute of Technology; Bill Weiner, Rose-Hulman Institute of Technology; Alan Chiu, Rose-Hulman Institute of Technology
Amy Adkins, North Carolina State University at Raleigh; Naji S. Husseini, North Carolina State University at Raleigh; Lianne Cartee, North Carolina State University at Raleigh
Kristen L. Sanford P.E., Lafayette College; Frederick Paige, Virginia Polytechnic Institute and State University; Philip J. Parker P.E., University of Wisconsin - Platteville; Rodolfo Valdes-Vasquez, Colorado State University
Hatsuko Yoshikubo, Shibaura Institute Of Technology, Japan; Sumito Nagasawa, Shibaura Institute of Technology, Japan; Hiroyuki Ishizaki, Shibaura Institute of Technology, Japan