Engineering Physics and Physics Division Technical Session 3
Collection
2019 ASEE Annual Conference & Exposition
Authors
Angeles Dominguez, Tecnologico de Monterrey, Monterrey, Mexico and Universidad Andres Bello, Santiago, Chile; Genaro Zavala, Tecnologico de Monterrey, Monterrey, Mexico and Universidad Andres Bello, Santiago, Chile
Engineering Physics and Physics Division Technical Session 3
Collection
2018 ASEE Annual Conference & Exposition
Authors
Angeles Dominguez, Tecnologico de Monterrey (ITESM) and Universidad Andres Bello (UNAB); Itzel Hernandez-Armenta, Tecnologico de Monterrey; Jorge Eugenio de la Garza Becerra, Tecnologico de Monterrey (ITESM)
Engineering Physics and Physics Division Technical Session 3
Collection
2018 ASEE Annual Conference & Exposition
Authors
Scott Alexander Kaiser, Utah Valley University; Reza Kamali, Utah Valley University; Paul Weber, Utah Valley University; Afsaneh Minaie, Utah Valley University
Using Computation and Modeling, Engineering Physics and Physics Division (EP2D) Technical Session 3
Collection
2023 ASEE Annual Conference & Exposition
Authors
Rodrigo Cutri, Mauá Institute of Technology, Brazil; Nair Stem, Mauá Institute of Technology, Brazil; Octavio Mattasoglio Neto Neto, Mauá Institute of Technology, Brazil
Using Computation and Modeling, Engineering Physics and Physics Division (EP2D) Technical Session 3
Collection
2023 ASEE Annual Conference & Exposition
Authors
Kristen Schumacher, University of Illinois, Urbana-Champaign; Sonali Joshi, University of Illinois, Urbana-Champaign; Jina Kang, University of Illinois, Urbana-Champaign; Eric Shaffer, University of Illinois, Urbana-Champaign; Jessica Raley, University of Illinois, Urbana-Champaign; Jose Nijaid Arredondo, University of Illinois, Urbana-Champaign; Brandon Mark Buncher, University of Illinois, Urbana-Champaign; Rajan Patkar, University of Illinois at Urbana-Champaign; Katherine Zine, University of Illinois, Urbana-Champaign; Daniel Alfredo Caballero, University of Illinois, Urbana-Champaign; Alexandria Tucker, University of Illinois, Urbana-Champaign; Mireille Tan, University of Illinois, Urbana-Champaign; Christopher Vistian, Physics Outreach at Illinois Through New Technologies
Using Computation and Modeling, Engineering Physics and Physics Division (EP2D) Technical Session 3
Collection
2023 ASEE Annual Conference & Exposition
Authors
Esmeralda Campos, Tecnológico de Monterrey, Mexico; Carlos Eduardo Martinez-Torteya, Tecnológico de Monterrey, Mexico; Genaro Zavala, Tecnológico de Monterrey, Mexico and Universidad Andres Bello, Chile