Luis Horacio Hernandez Carrasco P.E., Tecnologico de Monterrey (ITESM); Miguel X. Rodriguez-Paz, Tecnologico de Monterrey (ITESM); Saul E. Crespo, Tecnologico de Monterrey (ITESM)
Systems Engineering Division (SYS) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Amy Thompson, University of Connecticut; Matthew D. Stuber, University of Connecticut; Song Han, University of Connecticut; Abhishek Dutta, University of Connecticut; Hongyi Xu, University of Connecticut; Shengli Zhou, University of Connecticut; Qian Yang, University of Connecticut; Fei Miao, University of Connecticut; George M. Bollas, University of Connecticut
Hatsuko Yoshikubo, Shibaura Institute Of Technology, Japan; Sumito Nagasawa, Shibaura Institute of Technology, Japan; Hiroyuki Ishizaki, Shibaura Institute of Technology, Japan
Ana Cram, University of Texas at El Paso; Arunkumar Pennathur, University of Texas at El Paso; Amirmasoud Momenipour, Rose-Hulman Institution of Technology; Priyadarshini R. Pennathur, University of Texas at El Paso
Eric Markvicka, University of Nebraska-Lincoln; Jason Daniel Finnegan; Kasey Moomau; Amie Sueann Sommers; Markeya S. Peteranetz, University of Nebraska, Lincoln; Tareq A. Daher, University of Nebraska, Lincoln
Daniel B. Oerther, Missouri University of Science and Technology; Sarah Hultine Massengale, University of Missouri - St. Louis; Sarah Oerther, Saint Louis University
Faculty Development Division (FDD) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Helen Hu, Westminster College of Salt Lake City; Tricia D. Shepherd; Clifton L. Kussmaul, Green Mango Associates, LLC; Patricia B. Campbell, Campbell-Kibler Associates