ASEE PEER - Siqing Wei

Siqing Wei

Paper listing

ORCID identifier

Orcid 16x16

http://orcid.org/0000-0002-7086-5953

Permanent URL

https://peer.asee.org/authors/58162

Co-authors:

Bridging the Knowledge Gap Between Design Requirements and CAD - A Joint Embedding Approach

Conference Session: Design in Engineering Education Division (DEED) Technical Session 14
Collection: 2023 ASEE Annual Conference & Exposition
Authors: Cheng Chen, University of Georgia; Siqing Wei, Purdue University; Beshoy Morkos, University of Georgia

Initiating and sustaining international ethnic engineering education scholarly communities in the United States

Conference Session: Graduate Studies Division (GSD) Technical Session 8: International Perspectives in Graduate Education
Collection: 2024 ASEE Annual Conference & Exposition
Authors: Siqing Wei, Purdue University at West Lafayette (COE); Moses Olayemi, University of Oklahoma

Revisiting Tuckman’s Team Development Model in First-year Engineering Multicultural Teams

Conference Session: Student Teams and Teamwork
Collection: 2023 ASEE Annual Conference & Exposition
Authors: Siqing Wei, Purdue University at West Lafayette (COE); Amirreza Mehrabi, Purdue University; Li Tan, Arizona State University; Matthew W. Ohland, Purdue University at West Lafayette (COE)

Theorizing Neuro-Induced Relationships Between Cognitive Diversity, Motivation, Grit and Academic Performance in Multidisciplinary Engineering Education Context

Conference Session: Multidisciplinary Division Technical Session 11
Collection: 2024 ASEE Annual Conference & Exposition
Authors: Duy Duong-Tran, United States Naval Academy; Siqing Wei, Purdue University, West Lafayette; Li Shen, University of Pennsylvania

Uncovering the less-heard histories and barriers of Asian and Asian American Students

Conference Session: Track 3: Technical Session 6: Uncovering the less-heard histories and barriers of Asian and Asian American Students
Collection: 2025 Collaborative Network for Engineering & Computing Diversity (CoNECD)
Authors: Siqing Wei, Purdue University at West Lafayette (COE); Marissa A Tsugawa, Utah State University - Engineering Education; Li Tan, Arizona State University, Polytechnic Campus