June 14, 2009
June 14, 2009
June 17, 2009
Electrical and Computer
14.410.1 - 14.410.7
Design and Fabrication of Impact (Acceleration) Sensors as Class Projects in a MEMS Course
The paper describes use of SOI-MEMS fabricated Impact Sensors (Acceleration) as a real world design experience in an undergraduate senior level MEMS course. In addition to the standard lectures/reading/homeworks/tests routine of a typical coursework students were
integrated circuit layout tools and standard Silicon MEMS technologies available and known as as MUMPs (Multi-User-MEMS-Processes). The Silicon-On-Insulator version of MUMPs which is named - were combined to form a multi-project MEMS chip and sent out to be fabricated thanks to the funding received from NASA/MSGC. A test platform has been designed to create centrifugal g-forces sensors to correlate the theory, analytical equations used for designs and the experimental results.
Background and Description of the Work
The paper describes use of SOI-MEMS fabricated Impact (Acceleration) Sensors as a real world design experience in a senior undergraduate level MEMS course.
This is a brand new technical elective in our Engineering programs, open to both electrical engineering and mechanical engineering students, on the emerging multidisciplinary field of Micro-Electro-Mechanical-Systems, better kn include micromechanical structures, materials for MEMS and their thermal, electrical and mechanical properties, principles of microfabrication, micromechanics, electromechanical energy conversion and transduction. Basic electro-mechanical system blocks like beams, cantilevers, resonators, micro actuators are analyzed and their integration into the design of micro systems for applications in digital micro-mirror (DMM) projectors, acceleration and pressure sensors, RF and optical signal routers, micro pumps, micro motors and micro robots are discussed. Design tools for MEMS layout were demonstrated with the process steps and design rules of some stan - - - ease of use as well as the Windows operating system requirement familiar to all.
As a class design project students used these integrated circuit layout design tools demonstrated to design sensors for application in vehicle air bag deployment. The designs had to employ the SOI (Silicon On Insulator) MEMS process, - available from MEMScAP. Students were given a set of constraints such as the maximum chip area available as well as the design rules specified by the
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