Decker, B., & Simmons, P., & Sun, G. (2020, February), Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers  Paper presented at 2020 CIEC, Orlando (FL). 10.18260/1-2-60-38708

\bibitem{asee_peer_38708}
  Decker, B., \& Simmons, P., \& Sun, G. (2020, February), \emph{Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers}
  Paper presented at 2020 CIEC, Orlando (FL).
  10.18260/1-2-60-38708

Brian Decker, Paul Simmons, and Gang Sun.  "Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers".  2020 CIEC, Orlando (FL), 2020, February.  ASEE Conferences, 2020.  https://peer.asee.org/38708 Internet.  09 Oct, 2024

\bibitem{asee_peer_38708}
  Brian Decker, Paul Simmons, and Gang Sun.
  "Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers".
  \emph{2020 CIEC, Orlando (FL), 2020, February}.
  ASEE Conferences, 2020.
  https://peer.asee.org/38708 Internet.  09 Oct, 2024

@INPROCEEDINGS{asee_peer_38708
author = "Brian Decker, Paul Simmons, and Gang Sun"
title = "Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers"
booktitle = "2020 CIEC"
year = "2020"
month = "February"
address = "Orlando (FL)"
publisher = "ASEE Conferences"
note = {https://peer.asee.org/38708}
number = {10.18260/1-2-60-38708}
}

TY  - CPAPER
AU  - Brian Decker
AU  - Paul Simmons
AU  - Gang Sun
CY  - Orlando (FL)
DA  - 2020/02/15
PB  - ASEE Conferences
TI  - Designing a Low-Cost Embedded System Development Board with                                                      Convertible Intelligent Layers
UR  - https://peer.asee.org/38708
DO  - 10.18260/1-2-60-38708
ER  -