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Development of a SimEvents Model for Printed Circuit Board (PCB) Assembly Processes

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Conference

2023 ASEE Annual Conference & Exposition

Location

Baltimore , Maryland

Publication Date

June 25, 2023

Start Date

June 25, 2023

End Date

June 28, 2023

Conference Session

Redefining Manufacturing Education Practices

Tagged Division

Manufacturing Division (MFG)

Page Count

10

DOI

10.18260/1-2--43146

Permanent URL

https://peer.asee.org/43146

Download Count

208

Paper Authors

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Siqin Dong Old Dominion University

biography

Mileta Tomovic Old Dominion University

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Dr. Tomovic received BS in Mechanical Engineering from University of Belgrade, MS in Mechanical Engineering from MIT, and PhD in Mechanical Engineering from University of Michigan. Dr. Tomovic is Professor of Engineering Technology, and Mechanical and Aer

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Krishnanand Kaipa Old Dominion University Orcid 16x16 orcid.org/0000-0002-8095-938X

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Dr. Krishnanand Kaipa is an Assistant Professor and director of the Collaborative Robotics and Adaptive Machines (CRAM) Laboratory in the Department of Mechanical and Aerospace Engineering at the Old Dominion University. Dr. Kaipa received his BE (Hons.)

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Abstract

Printed circuit boards (PCBs) are the foundational building blocks of most modern electronic devices. PCB assembly is defined as the process of mounting different electronic components on a PCB. Circuit board assembly utilizes an automated technique with most steps completed by machines for different operations (e.g., pick-and-place components, soldering, etc.). In this paper, details of a student course project, carried out at Old Dominion University, on the design and simulation of PCB assembly processes based on MATLAB discrete-event system are presented. An essential component in the advanced manufacturing technology course is the hands-on experience where students implement multiple software simulation tools including SimEvents, Simulink, and MATLAB for a manufacturing scenario. Students learned the principles of the discrete-event system and how to create a discrete-event simulation model to simulate the passing of entities through a network of queues, servers, gates, and switches based on events to describe flexible manufacturing systems. The proposed SimEvents model consists of five subsystems, which are used to represent a machine for solder printing, two machines for picking and placing electronic components, a machine for reflow soldering, and a machine for X-ray inspection. The simulation processes help the students understand the manufacturing processes of PCB and how productivity can be affected by visualizing the number of parts in queue and number of parts completed in each subsystem with different setups and parameters.

Dong, S., & Tomovic, M., & Kaipa, K. (2023, June), Development of a SimEvents Model for Printed Circuit Board (PCB) Assembly Processes Paper presented at 2023 ASEE Annual Conference & Exposition, Baltimore , Maryland. 10.18260/1-2--43146

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