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Development Of An International Collaboration In Electrical (And Related) Engineering Disciplines Between The College Of Technology, Purdue University And The Faculty Of Engineering, Dublin Institute Of Technology

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Conference

2006 Annual Conference & Exposition

Location

Chicago, Illinois

Publication Date

June 18, 2006

Start Date

June 18, 2006

End Date

June 21, 2006

ISSN

2153-5965

Conference Session

ECE Poster Session

Tagged Division

Electrical and Computer

Page Count

15

Page Numbers

11.472.1 - 11.472.15

DOI

10.18260/1-2--1098

Permanent URL

https://peer.asee.org/1098

Download Count

158

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Paper Authors

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Richard Hayes Dublin Institute of Technology

author page

Robert Herrick Purdue University

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Abstract
NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Development of an International Collaboration in Electrical (and related) Engineering Disciplines between the College of Technology, Purdue University and the Faculty of Engineering, Dublin Institute of Technology.

Introduction

The College of Technology at Purdue University in the United States of America and the Faculty of Engineering at the Dublin Institute of Technology (DIT) in Ireland have, during the past two years, been working to develop an International Collaboration. This paper will describe in detail the issues related to the successful evolution of the collaboration between the departments of Electrical, Electronic Engineering in the two institutions. The main purpose of this paper is to start the process of documenting the collaboration process and to provide an ongoing source of reference for other institutions undertaking similar collaborations between the United States and Europe.

The emergence of Europe as an economic and federal entity over the last twenty years together with its multicultural and multilingual nature has meant that considerable effort has been devoted to the development of collaborations between academic institutions across the continent at undergraduate, post graduate and at research levels. It is hoped to bring the resulting accumulated experience to bear on the building of this collaboration between the United States and Europe.

European international exchange programs in engineering and technology have been strongly supported through organizations such as Erasmus, Socrates, and Leonardo1 to encourage mobility within Europe. The United States does not have a corresponding government program that generously supports such interchange. The U.S. Senate declaration of 2006 as the “Year of Study Abroad” combined with the U.S. Senate’s Lincoln Report2 that recommends that 1,000,000 U.S. students need to be studying abroad by the academic year 2016-17 lends impetus to international initiatives and outreach between U.S. universities and the rest of the world3,4. Scholarships are highly recommended by the Lincoln Report to encourage this major global outreach of U.S. students, but in the interim it is the efforts of individual universities reaching out that are making the difference. Examples of highly successful U.S. programs are illuminated annually as winners of the Paul A. Simon Award for Campus Internationalization5 and serve as good examples of proactively bringing the global experience to students.

This paper focuses on the forming of the Purdue College of Technology – DIT relationship and will review the similarities and the differences in teaching and other practices in a number of departments in both institutions and will report on some of the difficulties, successes and failures encountered in the process so far.

The paper will establish the parameters of the collaboration by firstly providing a comparison of the organizational structure at departmental level, identifying programs taught, subjects/courses and their relative levels and time lines.

Hayes, R., & Herrick, R. (2006, June), Development Of An International Collaboration In Electrical (And Related) Engineering Disciplines Between The College Of Technology, Purdue University And The Faculty Of Engineering, Dublin Institute Of Technology Paper presented at 2006 Annual Conference & Exposition, Chicago, Illinois. 10.18260/1-2--1098

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