June 26, 2011
June 26, 2011
June 29, 2011
22.569.1 - 22.569.8
Engaged in Thermodynamics – Addressing the Student to Learning Material InterfaceThis paper will discuss a new NSF-CCLI grant that addresses improvements in student pedagogyand educational materials for the engineering thermodynamics curriculum by completingdevelopment of the concept of an “Engineering Scenario”. Engineering Scenarios are textbooksupplements based on actual engineering facilities and equipment. They expand on the casestudy concept by including skills-based problems that can be used in place of traditionalhomework problems but written in the context of the real-world environment, as well asadditional design problems based on design methods and actual solutions at real facilities.Accompanying supplementary and background information promotes increased inquiry-based orstudent-centered learning, better addresses student real world expectations, and leads to anincrease in overall student engagement. A Phase 1 grant allowed for the development andrepeated formative assessment of a single scenario, leading to the current Phase 2 grant.The focus of this poster/paper will be the continued work on determining what makes a goodmaterial for students to use; both in terms of engagement and learning potential. This willinclude addressing issues of readability of the new material. This includes an evaluation andcomparison to popular thermodynamic textbooks on the market. Also discussed will be thecontinued work with the software interface to improve usability by students. This focuses on themanner in which students want to see and access the information. Development in both of theseareas is grounded in pedagogical insights obtained from additional focus groups withthermodynamics students discussing engagement issues.
Tebbe, P. A., & Saucedo, N., & Pribyl, J. R., & Ross, S. L. (2011, June), Engaged in Thermodynamics: Addressing the Student to Learning Material Interface Paper presented at 2011 ASEE Annual Conference & Exposition, Vancouver, BC. https://peer.asee.org/17850
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