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Engineer’s Skills for National Manufacturing Initiatives

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Conference

2016 EDI

Location

San Francisco, CA

Publication Date

March 29, 2016

Start Date

March 29, 2016

End Date

April 1, 2016

Conference Session

Wednesday Luncheon Keynote Presentation

Tagged Topics

engineer's skills and manufacturing initiatives

Page Count

19

DOI

10.18260/1-2--27367

Permanent URL

https://peer.asee.org/27367

Download Count

290

Paper Authors

author page

Xavier Fouger Dassault Systemes

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Abstract

The recent years have seen many governments realizing that sustained employment or economic development requires industry to embrace new principles such as user-centric value chains, responsive, agile, distributed (“smart”) production, global optimization of value creation, personalization, or new ways to reach consumers. From “Industrie 4.0” to “Manufacturing 2025”, “Manufacturing Renaissance”, “Make in India” or “Industry of the Future”, national manufacturing initiatives in various countries have mushroomed in support of the required transitions of sociotechnical practices, business models and economical and regulatory structures.

The new economy resulting from those initiatives will be designed and operated by engineers. Many of them are yet to graduate and the challenge on engineering educators is considerable. Personalized production techniques, distributed engineering and manufacturing, smart production facilities, globally dispersed stakeholders are some characteristics of the new industry that determine new competences in engineers. As a consequence of those initiatives, many new practices will gain momentum: additive manufacturing, crowd based innovation, big-data dashboarding, digital factory methods, the Internet of Things and its disruptive business models…

Because they will have large impacts on engineering skills, Dassault Systèmes works with industry to define them and with academia to bring them into the curriculum.

Fouger, X. (2016, March), Engineer’s Skills for National Manufacturing Initiatives Paper presented at 2016 EDI, San Francisco, CA. 10.18260/1-2--27367

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