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Experiences With The Transition To Smt

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Conference

2004 Annual Conference

Location

Salt Lake City, Utah

Publication Date

June 20, 2004

Start Date

June 20, 2004

End Date

June 23, 2004

ISSN

2153-5965

Conference Session

Electrical ET Laboratory Practicum

Page Count

5

Page Numbers

9.598.1 - 9.598.5

Permanent URL

https://peer.asee.org/13611

Download Count

23

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Paper Authors

author page

Glenn Blackwell

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Abstract
NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Session 2004 Experiences with the transition to Surface Mount Technology in ECET Labs Glenn R. Blackwell ECET – Purdue University West Lafayette, IN 47907-2021 gblack@purdue.edu

abstract The author has been actively involved with the use of surface mount technology (SMT) in Purdue’s ECET labs for 10 years. In that time the department has expanded its use of surface mount devices (SMDs) from use solely in an undergraduate SMT class, to use of SMDs in half of the upper-division courses. During that time the department has also expanded its use of electronic computer aided design (ECAD) software for the design and analysis of circuits and for the design of printed circuit boards (PCBs). The department has purchased equipment suitable for use on SMDs, has actively pursued donation of SMT parts, and has added a second course on electronic manufacturing.

background Surface mount technology (SMT) was developed in the 1960s & 1970s by IBM and others to reduce the size of electronic component packages and thereby reduce the size of electronic devices designed with those packages (1,2). The technology has other advantages, including reducing package-related parasitic capacitance and inductance, with concomitant increases in operating speeds, and allowing high-speed assembly automation. Disadvantages include the difficulty of heat dissipation from smaller packages with less surface area, difficulty in rework and repair, and difficulty in breadboarding prototypes. The advantages and disadvantages of SMT implementation have been well documented (3).

body In 2002 the worldwide production of integrated circuits showed 86% of IC production to be in surface mount packages. This impact of SMT on IC production leads us to the conclusion that both the basic concepts of SMT as well as design using SMT design for manufacturability (DFM) and design for testability (DFT) principles must be presented in BS programs.

Likewise, the advantages and disadvantages of designing with SMT are also well documented. The advantages include: • Smaller component packages • Smaller printed circuit board (PCB) designs • Lower package and PCB parasitic capacitance and inductance • Fewer circuit board layers required relative to the same design in THT • Many newer components are only available in SMT packages.

The disadvantages include:

“Proceedings of the 2004 American Society for Engineering Education Annual Conference and Exposition” Copyright 2004, American Society for Engineering Education”

Blackwell, G. (2004, June), Experiences With The Transition To Smt Paper presented at 2004 Annual Conference, Salt Lake City, Utah. https://peer.asee.org/13611

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