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Interdisciplinary Ece And Me Education In The Electro Thermal Performance Of Cmos Soc Devices

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Conference

2002 Annual Conference

Location

Montreal, Canada

Publication Date

June 16, 2002

Start Date

June 16, 2002

End Date

June 19, 2002

ISSN

2153-5965

Conference Session

ECE Design, Capstone, and Engr. Practice

Page Count

7

Page Numbers

7.724.1 - 7.724.7

Permanent URL

https://peer.asee.org/10175

Download Count

30

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Paper Authors

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Z. Joan Delalic

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Richard Cohen

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Jim J-S Chen

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Dennis Silage

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Abstract
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Session

Interdisciplinary ECE and ME Education in the Electro-Thermal Performance of CMOS SOC Devices

Z. Joan Delalic, Jim J-S Chen, Richard Cohen, Dennis Silage Electrical and Computer Engineering and Mechanical Engineering College of Engineering, Temple University

ECE and ME: Together Again

This interdisciplinary educational initiative presents curriculum and research, which is leading to a change in the traditional presentational of microelectronics, digital logic design, and heat transfer in engineering education. In the traditional and prevalent model, Electrical and Computer Engineering (ECE) and Mechanical Engineering (ME) each have its own set of courses and requirements within the boundaries of a specific discipline. However, the explosive growth in microelectronics and the resulting integrated circuit densities, not only for advanced processors but also for the system-on-chip (SOC) design methodology1, now demand ECE and ME graduates with a keen and focused interdisciplinary knowledge of the thermal performance and packaging of such VLSI devices. Furthermore, industry is demanding engineering graduates with the experience to become immediately productive without extensive additional training.

This engineering educational initiative addresses these salient concerns by creating a program of cross-training courses, dynamic modular courses, and interdisciplinary projects and research with the support of the microelectronics industry. The microelectronics industry is acutely aware of the need for innovations in packaging and thermal management to supplement the advances and promise of low power consumption CMOS design and the SOC design methodology. Such innovations are needed if the clock speed and computational power of compact future systems are to increase. This initiative addresses the development of curriculum in such micro and nano scale technology in microelectronics and VLSI and in the materials science, heat transfer, and thermal management of such devices and, as a consequence, builds a closer working relationship with the microelectronic industry

This interdisciplinary engineering educational program, which involves ECE and ME, has three components to better prepare undergraduate, graduate and continuing professional education students to become practitioners in microelectronics technology:

1. The cross-training of senior undergraduate engineering students in ECE and ME with modules of appropriate ECE courses taught to ME students and, conversely, modules of ME courses taught to ECE students. 2. Intermediate graduate and continuing professional education courses in ECE and ME, which continue this cross training. 3. Modular advanced graduate courses, which can be dynamically modified to satisfy industry requirements and research opportunities in microelectronics technology.

Proceedings of the 2002 American Society for Engineering Education Annual Conference & Exposition Copyright Ó2002, American Society for Engineering Education

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Delalic, Z. J., & Cohen, R., & Chen, J. J., & Silage, D. (2002, June), Interdisciplinary Ece And Me Education In The Electro Thermal Performance Of Cmos Soc Devices Paper presented at 2002 Annual Conference, Montreal, Canada. https://peer.asee.org/10175

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