June 12, 2005
June 12, 2005
June 15, 2005
10.860.1 - 10.860.11
Paper 2005-1511 Laboratories for the Design and Assembly of Electronic Devices using Surface Mount Components
Glenn R. Blackwell, P.E. Purdue University firstname.lastname@example.org
Abstract Purdue’s ECET department has supported surface mount technology (SMT) in its labs for over 10 years. In that time the department has expanded its teaching of the design and assembly of devices incorporating surface mount components (SMCs) from design basics and simple manual assembly in one undergraduate class, to more complex designs and manual & automated assembly in two electronic manufacturing courses, one undergraduate and one dual-level. The students in the department routinely use Cadence electronic computer aided design (ECAD) software for the design and analysis of circuits and for the design of printed circuit boards (PCBs). The boards are fabricated by a commercial PCB fabricator, then assembled in one of two laboratories the department has with assembly equipment suitable for both manual and automated assembly of SMCs.
This paper will briefly discuss the design concepts unique to SMT devices and the manual and automated assembly technologies suitable for use in teaching laboratories. SMCs from chip resistor and capacitor components through fine-pitch quad flat pack ICs can be manually soldered and desoldered from PCBs with equipment costing no more than $800. The paper will give examples of the manual tools necessary to perform these operations, as well as of semi-automated and fully-automated equipment suitable for SMC assembly, and ranging in cost from $6K for semi-automated tools to $30K for a small automated assembly line. The paper will also present examples of projects completed by students, as well as learning objectives for the undergraduate course.
Introduction – why teach SMT? Consumers have demanded the proliferation of personal electronic devices and their continued reduction in size with a continued increase in performance. Many of the technology improvements that allow these continual changes are attributable to advances in two areas, those in semiconductor silicon fabrication and those in electronic component packaging. While the former technologies tend to get the most press, the latter technologies are used by far more companies and are more likely to get taught at the university level, since more graduates are likely to need a knowledge of packaging technologies in their employment. The author believes this is true since many graduates of technical programs will be involved in the design, manufacturing, testing and/or support of electromechanical devices, and these areas are better served by personnel with knowledge of electronic packaging and assembly processes.
“Proceedings of the 2005 American Society for Engineering Education Conference & Exposition Copyright © 2005, American Society for Engineering Education”
Blackwell, G. (2005, June), Laboratories For The Design And Assembly Of Electronic Devices Using Surface Mount Components Paper presented at 2005 Annual Conference, Portland, Oregon. 10.18260/1-2--14479
ASEE holds the copyright on this document. It may be read by the public free of charge. Authors may archive their work on personal websites or in institutional repositories with the following citation: © 2005 American Society for Engineering Education. Other scholars may excerpt or quote from these materials with the same citation. When excerpting or quoting from Conference Proceedings, authors should, in addition to noting the ASEE copyright, list all the original authors and their institutions and name the host city of the conference. - Last updated April 1, 2015