Modelling and Designing a Mechatronics System for High Speed Packaging Operations Using Mechatronics Methodology
- Conference
- Location
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Columbus, Ohio
- Publication Date
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June 24, 2017
- Start Date
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June 24, 2017
- End Date
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June 28, 2017
- Conference Session
- Tagged Division
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Instrumentation
- Tagged Topic
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Diversity
- Page Count
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16
- DOI
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10.18260/1-2--28679
- Permanent URL
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https://peer.asee.org/28679
- Download Count
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2324
Paper Authors
Vivek Pillarisetty P.E. Purdue University Northwest
Vivek Pillarisetty is an Indian Graduate Student studying Mechatronics in Purdue University, Calumet in the state Indiana. He has done his under graduation in KLUniversity, Vijayawada, India. He is an outstanding student and favorite for all of his professors.
He is an active participant in both co curricular and extra curricular activities. He is an avid reader and an interpreter. He learns the subject in depth and tries to work hands on whatever he learns. He is currently doing his research in packaging technology under Professor Akram Hossain in Purdue University, Calumet. After seeing his insight, the Professor offered him a Teaching Assistant position in the laboratory for guiding the students in the subject of Mechatronics.
Akram Hossain Purdue University Northwest
Akram Hossain, Purdue University Calumet
Akram Hossain is a professor in the department of Engineering Technology and Director of the Center for Packaging Machinery Industry at Purdue University Calumet, Hammond, IN. He worked eight years in industry at various capacities. He is working with Purdue University Calumet for the past 27 years. He consults for industry on process control, packaging machinery system design, control and related disciplines. He is a senior member of IEEE and he served in IEEE/Industry Application Society for 15 years at various capacities. He served as chair of Manufacturing Systems Development Applications Department (MSDAD) of IEEE/IAS. Currently, he is serving a two-year term as the chair of the Instrumentation of ASEE (American Society of Engineering Education). He authored over 29 refereed journal and conference publications. In 2009 he as PI received NSF-CCLI grant entitled A Mechatronics Curriculum and Packaging Automation Laboratory Facility. In 2010 he as Co-PI received NSF-ATE grant entitled Meeting Workforce Needs for Mechatronics Technicians. From 2003 through 2006, he was involved with Argonne National Laboratory, Argonne, IL in developing direct computer control for hydrogen powered automotives. He is also involved in several direct computer control and wireless process control related research projects. His current interests are in the area of packaging machinery system design & control, industrial transducers, industrial process control systems, modeling and simulation of Mechatronics devices and systems in virtual environment, programmable logic controllers, programmable logic devices, renewable energy related projects, wireless controls, statistical process control, computer aided design and fabrication of printed circuit board.
Abstract
Accomplishing a lean manufacturing standards and increasing rate of production are very
important for today’s industry. An automated system, like one that achieves packaging rates of
up to 300 parts per minute, appears to be the answer. Industrial automation is an engineering
marvel. Mechatronics is synergistic yet a multidisciplinary field of science which adopts and
shares platform between interdisciplinary engineering technologies. The process of operation of
a control systems (Mechatronics System) incorporates different modules in it, which does
different tasks like an assembly line. Considering all these, high-speed systems depend on the
synchronized interplay between parts. When a motor and a load are coupled together, the ratio of
load inertia to motor inertia determines how well the motor can control the load during
acceleration and deceleration. When it comes to high speed motion control, torque alone is not
enough.
Applications like 300 part-per- minute packaging or 3D printing require ultrahigh speed
operation, accurate positioning, and tight synchronization among dozens of axes. Mechatronics
(Electromechanical) systems can provide this degree of performance, but they depend on proper
interplay between the mechanical properties and the electrical properties of the system. This
unsynchronized process leads in inertia mismatch, which is one of the most common problem
that many industries face these days. To study and analyze this mismatch modeling is the most
inexpensive and a great time saver in the process of designing a Mechatronics system.
There are many different ways the modeling of a system can be achieved. The LabVIEW is one
of most powerful software tool and we applied this tool to model the mechatronics
(electromechanical) systems. As a matter of fact we have unleashed the power of this tool by
applying it for modeling purposes. By using this tool we were able to generate very accurate
results that matches the desired outcome. Since our analysis using models are performed in
advance, it saves time, money and provides dynamic features that was never experienced before.
This model also delivers the results in graphical format which is an easier way to understand a
complex mechatronics system performance. Also our model is very suitable for future transition
to real world mechatronics system. Implementation of this model would provide us with
advanced understanding of torque, inertia mismatch, and motion profile of the process. Motor
sizing is also done based on the surge curve that is generated through this modeling process.
With the results in hand, it is an added advantage to either build a custom motor or compare with
the existing motor specification already available from various manufacturers. Motion analysis
of Mechatronics system using modeling is a very dynamic, inexpensive, and provides
Mechatronics system manufacturer vital information at the development stage.
Pillarisetty, V., & Hossain, A. (2017, June), Modelling and Designing a Mechatronics System for High Speed Packaging Operations Using Mechatronics Methodology Paper presented at 2017 ASEE Annual Conference & Exposition, Columbus, Ohio. 10.18260/1-2--28679
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