Chicago, Illinois
June 18, 2006
June 18, 2006
June 21, 2006
2153-5965
Instrumentation
12
11.960.1 - 11.960.12
10.18260/1-2--1438
https://peer.asee.org/1438
610
JUn Kondo is a research engineer at the Engineering Applications Center, University of Hartford
Santiago Noriega is a graduate student of Mechanical Engineering. He hold a Bachelor degree in Mechanical Engineering
NON CONTACT VIBRATION ANALYSIS USING INNOVATIVE LASER BASED METHODOLOGY
Devdas Shetty, Santiago Noriega and Jun Kondo College of Engineering, Technology and Architecture, University of Hartford, Connecticut
ABSTRACT
Due to increasing requirements in performance, in areas such as computers and automobiles, manufacturing companies have been forced to produce within tighter tolerances and perform more elaborate testing to validate their products. In the case of automotive manufacturers the measurement of vibration is essential. In the past, equipment such as strain gauges and piezoelectric accelerometers have been adequate in measuring it. However, they have had several disadvantages. One disadvantage being that the part must be mounted on the surface of the object being measured. This can result in the mass altering the frequency and mode shape of the vibrating object. Laser technology is a non-contact measuring method providing the resolution needed to satisfy the changing requirements. At this time however, the cost of this equipment prevents companies from pursuing it as a solution. This paper provides an innovative method of detecting vibration using a low cost laser based method. It is not only a research tool, but can also be used in the education of scientists, engineers and technologists. The paper outlines the design methodology and test results.
INTRODUCTION:
One of the most critical tasks during the design of a system that has moving parts is to determine the level of vibration that the system will be exposed to and where this vibration could become a liability.
The fan industry for example; has experienced fatigue failures in their lead-wires due to higher deflection at specific frequencies than expected. The higher deflection increased the stress loading at the connection between the wires and the printed circuit boards causing the wires to break and in some cases for product to be recalled.
Kondo, J., & Noriega, S., & Shetty, D. (2006, June), Non Contact Vibration Analysis Using Innovative Laser Based Methodology Paper presented at 2006 Annual Conference & Exposition, Chicago, Illinois. 10.18260/1-2--1438
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