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Preparing For Engineering 2020: A New Course In Electronic Manufacturing For Electrical And Computer Engineering Majors.

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Conference

2010 Annual Conference & Exposition

Location

Louisville, Kentucky

Publication Date

June 20, 2010

Start Date

June 20, 2010

End Date

June 23, 2010

ISSN

2153-5965

Conference Session

Student Engagement in ECE

Tagged Division

Electrical and Computer

Page Count

10

Page Numbers

15.974.1 - 15.974.10

Permanent URL

https://peer.asee.org/15804

Download Count

44

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Paper Authors

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Maher Rizkalla Indiana University-Purdue University, Indianapolis

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MIchael Knieser ILSI

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Mohamed El-Sharkawy Purdue University

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Abstract
NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Preparing for Engineering 2020: A New Course in Electronic Manufacturing for Electrical and Computer Engineering Majors.

Maher E. Rizkalla, Michael Knieser, and Mohamed El-Sharkawy, and Nilashis Dey Department of Electrical and Computer Engineering 723 West Michigan Street (Rm. SL160) Indianapolis, IN 46202 Telephone Number: (317) 274-9719 E-mail: mrizkall@iupui.edu

Key words: engineering education, ECE, processes, ASIC, PCB, MEMS, CAD, industrial involvement.

ABSTRACT A new course in electronic manufacturing for senior electrical and computer engineering was developed at Indiana University Purdue University Indianapolis (IUPUI) to incorporate importance of information technology and processes in engineering. The course covers elements from engineering 2020 objectives. This includes new technology with industrial involvement towards the application specific integrated circuits, printed circuit board design, and micro electro motion (MEMS). A layout editor, Catapult software and L-Edit, software from Tanner research Inc have been utilized for the custom ASIC design.

The course was offered before at IUPUI with the two components ASIC &FPGA, and PCB technologies, and then modified to feature MEMS technology. The paper details the contents and the CAD tools used in the design. The course was three credit hour delivered in one semester (16 weeks) in three separate modules, one credit hour each. Students can register for one or more module within a semester period. The industrial partner at the Indiana Life Sciences Inc. was part of the teaching team for the PCB and MEMS sections.

I. INTRODUCTION With the continued and rapid increase of technology, electronic manufacturing has become a significant sector in manufacturing industry. Electronic production world wide is undergoing a revolutionary change at both component and system levels, utilizing chip and board technologies. The new technologies have reduced component size and costs and have improved reliability and safety of the electronic products. Electrical and computer engineering education recently has been following changes to integrate new technologies into curricula and keep up with the fast pace leading to prepared engineers who can contribute to improvement of quality life incorporating business, social, and ethical issues.

The field of electronic manufacturing is a multidisciplinary area that encompasses several technologies from electrical, materials, industrial, chemical, and computer engineering. For example, circuit analysis, digital and analog electronics, software,

Rizkalla, M., & Knieser, M., & El-Sharkawy, M. (2010, June), Preparing For Engineering 2020: A New Course In Electronic Manufacturing For Electrical And Computer Engineering Majors. Paper presented at 2010 Annual Conference & Exposition, Louisville, Kentucky. https://peer.asee.org/15804

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