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The Capstone Marketplace: An Online Tool for Matching Capstone Design Students to Sponsors with Challenging Problems

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2015 ASEE Annual Conference & Exposition


Seattle, Washington

Publication Date

June 14, 2015

Start Date

June 14, 2015

End Date

June 17, 2015





Conference Session

Design in Engineering Education Division Poster Session

Tagged Division

Design in Engineering Education

Tagged Topic


Page Count


Page Numbers

26.1509.1 - 26.1509.16



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Paper Authors


Michael Delorme Stevens Institute of Technology (SES)

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Mr. DeLorme has 11 years of professional experience as a Research Associate/Engineer at Stevens; Davidson Laboratory, DHS National Center for Secure and Resilient Maritime Commerce (CSR); and Systems Engineering Research Center. Research concentrations include experimental marine hydrodynamics, unmanned marine vehicles, the implementation of hydro-acoustics for the detection of marine vehicles, and the coordination of complex multidisciplinary systems engineering–focused student design and development projects.

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The Capstone Marketplace: An Online Tool for Matching Capstone Design Students to Sponsors with Challenging ProblemsAbstractThe Capstone Marketplace is an online tool developed and maintained to match multi-disciplinary student teams with challenging engineering projects. This marketplace is open to allUS schools capable of participating in capstone projects. The project sponsors provide domainexpertise and advice, students research the project details and work towards solutions, whilefaculty supervisors help guide the teams and grade their work. The capstone marketplace makesit easier for sponsors to reach out to a broad pool of students and provide them with the addedbenefit of an engaged and knowledgeable mentor. Students can more easily find projects bestmatched to their interests and needs and faculty have an open source for student projects that canlead to new research partners and collaboration.The capstone marketplace was created by the --X-- --X-- Research Center (XXRC) to helpaddress a critical challenge of developing the next generation of systems engineering (SE) talentfor future US DoD and defense industry needs. Given the scope of engineering opportunitiesgenerated by the US DoD, and the increasing complexity of engineering projects in today’sworld, it is clear that the emerging engineering workforce needs to have an understanding ofsystems engineering processes and tools. The capstone marketplace provides an importantopportunity for students to enhance their system engineering knowledge by: • Working on real and complex problems with engaged mentors • Working on multi-disciplinary teams • Implementing and gaining experience with systems engineering approaches and processes.Previous research has demonstrated that students who worked on multi-disciplinary capstoneprojects had increased interest and learning in basic systems engineering concepts. They alsodeveloped a better appreciation of the differences in methods and tools of different engineeringdisciplines. For each capstone marketplace project the sponsor provides funding and a mentor orsubject matter expert. The project mentor has proven to be a critical component, providinginsights and knowledge that lead to better outcomes for the students, sponsor, and faculty. In itsthird year of existence the Capstone Marketplace now has engaged over 70 students at 6institutions and 5 sponsors. There have not only been multi-disciplinary, but multi-institution andmulti-sponsor projects. Currently there are ten active projects representing 40 students at 4institutions.This paper will cover; the basics of the capstone marketplace, outcomes of recent projects with afocus on ABET’s Engineering Accreditation Commission (EAC) general criterion 3 for studentoutcomes, the status of selected current projects and the future of the capstone marketplace as atool for students, faculty, sponsors, and the engineering community.

Delorme, M. (2015, June), The Capstone Marketplace: An Online Tool for Matching Capstone Design Students to Sponsors with Challenging Problems Paper presented at 2015 ASEE Annual Conference & Exposition, Seattle, Washington. 10.18260/p.24847

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