Virtual On line
June 22, 2020
June 22, 2020
June 26, 2021
A heat transfer laboratory on designing and performing thermal analysis of a heat sink was developed. Students learned to design and build their own heat sink using a metal 3 D printer. They had freedom to build a heat sink with the desired size, geometry, material, number of fins and fin arrangement. A heat source, cartridge heaters embedded aluminum block, simulating a microprocessor (with 2 cm by 2 cm and 5 mm thick) dissipating 40 Watts of heat was provided. The heat sink was designed to maintain the temperature of the simulator at 50 °C or less to avoid overheating. The main constraints to the design of heat sinks were size and material cost. Students also needed to develop an experimental plan on how to proceed the experiment. The thermal performance test was conducted in a wind tunnel with variable air speed. Students also discussed about the feasibility of using the heat sink in natural convection. For the theory part, they were required to look into the theories and mathematical equations to justify their design. The experimental data including the rate of heat transfer through the heat sink was also compared with the theoretical results. From this laboratory, students learned to choose or design heat sinks that meet the cooling requirements for a particular application.
Kim, H. (2020, June), Thermal Analysis of Heat Sinks with Metal 3-D Printer Paper presented at 2020 ASEE Virtual Annual Conference Content Access, Virtual On line . 10.18260/1-2--35385
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