BOARD # 406: NSF INCLUDES Research Experience and Mentoring (REM) Program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem (WIP)

Kenneth A Connor; Shayla Sawyer; Barry J. Sullivan; Elizabeth Hibbler

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Conference: 2025 ASEE Annual Conference & Exposition
Location: Montreal, Quebec, Canada
Publication Date: June 22, 2025
Start Date: June 22, 2025
End Date: August 15, 2025
Conference Session: NSF Grantees Poster Session II
Tagged Topics: Diversity and NSF Grantees Poster Session
Page Count: 6
DOI: 10.18260/1-2--55782
Permanent URL: https://peer.asee.org/55782
Download Count: 4

Paper Authors

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Kenneth A Connor Rensselaer Polytechnic Institute orcid.org/0000-0002-4216-763X

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Kenneth Connor is Program Officer at the Inclusive Engineering Consortium (IEC), whose mission is to enable MSI ECE programs to produce more and better prepared graduates from groups that have been historically underrepresented in ECE careers. He is also an emeritus professor in the Department of Electrical, Computer, and Systems Engineering (ECSE) at Rensselaer Polytechnic Institute (RPI) where he taught courses on electromagnetics, electronics and instrumentation, plasma physics, electric power, and general engineering. His research involves plasma physics, electromagnetics, photonics, biomedical sensors, engineering education, diversity in the engineering workforce, and technology enhanced learning. He learned problem solving from his father (who ran a gray iron foundry), his mother (a nurse) and grandparents (dairy farmers). He has had the great good fortune to always work with amazing people, most recently the members and leadership of the IEC from HBCU, HSI, and TCU ECE programs and the faculty, staff and students of the Lighting Enabled Systems and Applications (LESA) ERC, where he was Education Director until his retirement in 2018. He was RPI ECSE Department Head from 2001 to 2008 and served on the board of the ECE Department Heads Association (ECEDHA) from 2003 to 2008. He is a Life Fellow of the IEEE.

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Shayla Sawyer Rensselaer Polytechic Institute

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Barry J. Sullivan Electrical & Computer Engineering Department Heads Assn

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Barry J. Sullivan is Director of Program Development for the Inclusive Engineering Consortium. His 40-year career includes significant experience as a researcher, educator, and executive in industry, academia, and the non-profit sector. He has developed

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Elizabeth Hibbler Conference for Industry and Education Collaboration (CIEC)

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Abstract

The NSF INCLUDES REM program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem supplement is a direct result of the workforce development ideation workshop funded by the parent proposal Collaborative Research: FuSe: Interconnects with Co-Designed Materials, Topology, and Wire Architecture. On March 15th, 2024, the FuSe Workshop – Interconnecting the Next Generation Semiconductor Workforce from Thinkers to Doers to Innovators was held in Tucson, Arizona at the ECEDHA conference. Technical Research PIs and associated industry members worked together with 25 representatives from the *** Consortium (***) and *** Foundation (***) to ideate opportunities to engage students in the microelectronic ecosystem. The *** is a well-established network of core members from 21 Historically Black Colleges and Universities (HBCUs), Hispanic Serving Institutions (HSIs) and Tribal Colleges and Universities (TCUs), and 15 affiliate members from Predominantly White Institutions (PWIs), some of which are also HSIs. The *** is the student-facing arm of the *** with a Pathways to Success program that combines internship experiences with holistic, structured mentorship.

This NSF INCLUDES supplement funds results of the ideation workshop focused on increasing the microelectronic talent pool. The research plan intentionally positions engaging experiences at essential transition points throughout the microelectronic curriculum by embedding microelectronic-centered design opportunities in a collaborative cohort of students, academic mentors, industry mentors, and faculty at different locations. The experiences are co-designed, co-delivered educational modules from all stakeholders aimed at increasing the interconnection of personal interest, creativity, fundamental knowledge, and skills through the inspiration of design-based pedagogy. This effort will answer questions that affect the wide distribution of knowledge in the microelectronic field including: What is the minimum microelectronic and semiconductor practical skillset for undergraduate students to feel competent and confident before entering research or industrial experiences in the microelectronic area? How does this confidence in practical skills motivate deeper theoretical understanding? How do open-source (free or reduced price) design tools compare to proprietary software for creativity, system-level understanding, fundamental understanding, and industry readiness? What are the tradeoffs? How can co-curricular activities fulfill the above needs in a cheaper and more flexible way to widen participation at schools without resources to fabricate devices?

First year activities involving students, faculty and staff from several HBCUs, two PWIs, and multiple companies in a variety of activities, each of which will inform the planning and delivery of the activities that follow: • Hybrid/Remote Multi-University Design Ideation Experiences for Faculty Mentors (Fall and Spring Semester) • Faculty/Graduate Mentorship Training (Fall Semester) • Hybrid/Remote Design Skills Development Workshops for Students (Between Fall and Spring Semester and after Spring Semester) • Pre-Internship Experience University Cleanroom Training (Between Spring Semester and Summer) • Internship within Microelectronic Ecosystem through Inclusive Engineering Foundation Pathways Program (Summer) • Post-Internship Experience Peer Mentorship Training (End of Summer)

Citation
Format

Connor, K. A., & Sawyer, S., & Sullivan, B. J., & Hibbler, E. (2025, June), BOARD # 406: NSF INCLUDES Research Experience and Mentoring (REM) Program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem (WIP) Paper presented at 2025 ASEE Annual Conference & Exposition , Montreal, Quebec, Canada . 10.18260/1-2--55782

TY  - CPAPER
AB  - The NSF INCLUDES REM program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem supplement is a direct result of the workforce development ideation workshop funded by the parent proposal Collaborative Research: FuSe: Interconnects with Co-Designed Materials, Topology, and Wire Architecture. On March 15th, 2024, the FuSe Workshop – Interconnecting the Next Generation Semiconductor Workforce from Thinkers to Doers to Innovators was held in Tucson, Arizona at the ECEDHA conference. Technical Research PIs and associated industry members worked together with 25 representatives from the *** Consortium (***) and *** Foundation (***) to ideate opportunities to engage students in the microelectronic ecosystem. The *** is a well-established network of core members from 21 Historically Black Colleges and Universities (HBCUs), Hispanic Serving Institutions (HSIs) and Tribal Colleges and Universities (TCUs), and 15 affiliate members from Predominantly White Institutions (PWIs), some of which are also HSIs. The *** is the student-facing arm of the *** with a Pathways to Success program that combines internship experiences with holistic, structured mentorship. 

This NSF INCLUDES supplement funds results of the ideation workshop focused on increasing the microelectronic talent pool. The research plan intentionally positions engaging experiences at essential transition points throughout the microelectronic curriculum by embedding microelectronic-centered design opportunities in a collaborative cohort of students, academic mentors, industry mentors, and faculty at different locations. The experiences are co-designed, co-delivered educational modules from all stakeholders aimed at increasing the interconnection of personal interest, creativity, fundamental knowledge, and skills through the inspiration of design-based pedagogy. This effort will answer questions that affect the wide distribution of knowledge in the microelectronic field including: What is the minimum microelectronic and semiconductor practical skillset for undergraduate students to feel competent and confident before entering research or industrial experiences in the microelectronic area? How does this confidence in practical skills motivate deeper theoretical understanding? How do open-source (free or reduced price) design tools compare to proprietary software for creativity, system-level understanding, fundamental understanding, and industry readiness? What are the tradeoffs? How can co-curricular activities fulfill the above needs in a cheaper and more flexible way to widen participation at schools without resources to fabricate devices?

First year activities involving students, faculty and staff from several HBCUs, two PWIs, and multiple companies in a variety of activities, each of which will inform the planning and delivery of the activities that follow:
•	Hybrid/Remote Multi-University Design Ideation Experiences for Faculty Mentors (Fall and Spring Semester)
•	Faculty/Graduate Mentorship Training (Fall Semester)
•	Hybrid/Remote Design Skills Development Workshops for Students (Between Fall and Spring Semester and after Spring Semester)
•	Pre-Internship Experience University Cleanroom Training (Between Spring Semester and Summer)
•	Internship within Microelectronic Ecosystem through Inclusive Engineering Foundation Pathways Program (Summer)
•	Post-Internship Experience Peer Mentorship Training (End of Summer)

AU  - Kenneth A Connor
AU  - Shayla Sawyer
AU  - Barry J. Sullivan
AU  - Elizabeth Hibbler
CY  - Montreal, Quebec, Canada 
DA  - 2025/06/22
PB  - ASEE Conferences
TI  - BOARD # 406: NSF INCLUDES Research Experience and Mentoring (REM) Program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem (WIP)
UR  - https://peer.asee.org/55782
DO  - 10.18260/1-2--55782
ER  -