Monica E Cardella, Purdue University, West Lafayette; Gina Navoa Svarovsky, Science Museum of Minnesota; Brianna L Dorie, Purdue University, West Lafayette
Brianna L Dorie, Purdue University, West Lafayette; Zdanna Tranby; Scott K Van Cleave, Science Museum of MN; Monica E Cardella, Purdue University, West Lafayette; Gina Navoa Svarovsky, Science Museum of Minnesota
Terrell Lamont Strayhorn, Ohio State University; Leroy L. Long III, Ohio State University; Joseph A Kitchen, Ohio State University; Michael Steven Williams, Ohio State University; Meg E. Stentz, Ohio State University
Annita Alting, Grove School of Engineering, The City College of the City University of New York; Feridun Delale, City College of the City University of New York; Joseph Barba, City College of the City University of New York
Rafic Bachnak, Texas A&M International University; Rohitha Goonatilake; Sofía Carolina Maldonado, Texas A&M International University; Dan Mott, Texas A&M International University
S. Patrick Walton, Michigan State University; Daina Briedis, Michigan State University; Mark Urban-Lurain, Michigan State University; Timothy J Hinds, Michigan State University; Carmellia Davis-King, Michigan State University; Thomas F. Wolff P.E., Michigan State University
Stacy Holander Gleixner, San Jose State University; Katherine Casey, SJSU College of Engineering; Jared T. Tuberty, San Jose State University; Sanela Latic; Patricia R Backer, San Jose State University; Emily L. Allen, San Jose State University
Edmund Tsang, Western Michigan University; Laura Darrah, Residence Life, Western Michigan University; Paul V. Engelmann, Western Michigan University; Cynthia Halderson, Western Michigan University; Bryan W. Thumme, Western Michigan University; Anetra Grice, Western Michigan University
Global Competency and What Makes a Successful Engineer
Collection
2013 ASEE Annual Conference & Exposition
Authors
Holt Zaugg, Brigham Young University; Alan R Parkinson, Brigham Young University; Spencer P. Magleby, Brigham Young University; Randall Davies, Brigham Young Univeristy