College Industry Partnerships Division (CIP) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Martha Cervantes, Johns Hopkins University ; Sydney Danielle Floryanzia, University of Washington and Johns Hopkins University; Jackie Sharp; William Roberts Gray-Roncal; Erik C. Johnson, University of Illinois, Urbana-Champaign
College Industry Partnerships Division (CIP) Poster Session
Collection
2023 ASEE Annual Conference & Exposition
Authors
Magdalena Villaseca, Universidad Andres Bello; Juan Felipe Calderon, Universidad Andres Bello, Viña del Mar, Chile; Maria Elena Truyol, Universidad Andres Bello, Santiago, Chile
College Industry Partnerships Division (CIP) Poster Session
Collection
2023 ASEE Annual Conference & Exposition
Authors
Jennifer Linvill, Purdue University; Imani N. Adams, Purdue University; Emily M. Haluschak, Purdue University at West Lafayette (COE); Breejha Sene Quezada, Purdue Engineering Education; Tamara J. Moore, Purdue University at West Lafayette (COE)
College Industry Partnerships Division (CIP) Poster Session
Collection
2023 ASEE Annual Conference & Exposition
Authors
Lufan Wang, Florida International University; Ruoying Chu; Fangzhou Xia, Massachusetts Institute of Technology; Zhuoxuan Li, Stanford University; Yan Wei, Southern University of Science and Technology; Yiming Rong, Southern University of Science & Tech
College Industry Partnerships Division (CIP) Poster Session
Collection
2023 ASEE Annual Conference & Exposition
Authors
Erik Backus, Clarkson University; Paul Edward Dougall; Shane W. Rogers, Clarkson University; Jennifer S. Atchison, Drexel University; JoAnn W. Rogers; Philip J. Parker P.E., University of Wisconsin - Platteville
College Industry Partnerships Division (CIP) Technical Session 2
Collection
2023 ASEE Annual Conference & Exposition
Authors
Jagadish Torlapati, Rowan University; Jodi F. Prosise, University of Wisconsin, Platteville; Philip J. Parker, P.E., University of Wisconsin, Platteville; Kauser Jahan, Rowan University; Moira Kelly Smith
College Industry Partnerships Division (CIP) Technical Session 2
Collection
2023 ASEE Annual Conference & Exposition
Authors
Andrew Pierce, Purdue University, West Lafayette ; William C. Oakes, Purdue University, West Lafayette ; Robin D. Terwilliger, Purdue University, West Lafayette ; Jorge Martinez, Purdue University, West Lafayette
College Industry Partnerships Division (CIP) Poster Session
Collection
2023 ASEE Annual Conference & Exposition
Authors
Jacalynn Sharp, JHU APL; Julianne Burroughs; Jorge Luis Rivera; Aishwarya Jayabharathi; Katherine-Ann Carr; William Roberts Gray-Roncal; Danielle Patrice Hilliard, Johns Hopkins University, Laurel; Alberto J. De Jesus Santiago
College Industry Partnerships Division (CIP) Technical Session 2
Collection
2024 ASEE Annual Conference & Exposition
Authors
Kerrie Danielle Hooper, Florida International University; Trina L. Fletcher, Florida International University; Edward Collins, National Society of Black Engineers; Rochelle L Williams, Graduate Fellowships for STEM Diversity; Ahlam Alharbi, Imam Abdulrahman Bin Faisal University
College Industry Partnerships Division (CIP) Technical Session 3
Collection
2024 ASEE Annual Conference & Exposition
Authors
Florence Emilia Castillo, University of Texas at Dallas; Yvette E. Pearson P.E., University of Texas at Dallas; Sherri S Frizell, Prairie View A&M University; Sheryl Skaggs, University of Texas at Dallas; Tiffany Bisbey, The George Washington University
College Industry Partnerships Division (CIP) Technical Session 1
Collection
2024 ASEE Annual Conference & Exposition
Authors
Reem Khojah, University of California, San Diego; Alyssa Catherine Taylor, University of California, San Diego; Isgard S. Hueck, University of California, San Diego
College Industry Partnerships Division (CIP) Technical Session 2
Collection
2024 ASEE Annual Conference & Exposition
Authors
Mohamed Razi Nalim, Indiana University-Purdue University Indianapolis; Nirmala Priyanka Manthripragada, Indiana University-Purdue University Indianapolis; CLIFF CAMPBELL, Indiana University-Purdue University Indianapolis; Sabya Mishra, The University of Memphis; Clayton Nicholas, Indiana University
College Industry Partnerships Division (CIP) Technical Session 1
Collection
2024 ASEE Annual Conference & Exposition
Authors
Chun Kit Chan, The University of Hong Kong; H.H. Cheung, University of Hong Kong; Match Ko, University of Hong Kong; Chun Kit Chui, University of Hong Kong; LEI YANG, The University of Hong Kong