Richard House, Rose-Hulman Institute of Technology; Anneliese Watt, Rose-Hulman Institute of Technology; Julia Williams, Rose-Hulman Institute of Technology
Frank Kowalski, Colorado School of Mines; Julia Williams, Rose-Hulman Institute of Technology; Rob Reed, Hewlett-Packard Corporation; Jim Vanides, Hewlett-Packard
Matthew Roberts, University of Wisconsin-Platteville; Christina Curras, University of Wisconsin-Platteville; Philip Parker, University of Wisconsin-Platteville
Oyebisi Samuel Oyediran; Olawale Babatunde Akinwale, Dept of Electronic and Electrical Engineering, Obafemi Awolowo University, Ile-Ife, Nigeria.; Kayode Peter Ayodele, Obafemi Awolowo University, Nigeria; Lawrence O Kehinde P.E., Obafemi Awolowo University, Ile-Ife, Osun State
Yizhe Chang, Stevens Institute of Technology; El-Sayed S. Aziz, Stevens Institute of Technology (SES); Sven K. Esche, Stevens Institute of Technology; Constantin Chassapis, Stevens Institute of Technology (SES)
Stephen Crown, University of Texas, Pan American; Arturo Fuentes, University of Texas, Pan American; Robert Jones, University of Texas, Pan American; Rajiv Nambiar, University of Texas, Pan American; Deborah Crown, San Jose State University
Aparna Sukhavasi, Missouri University of Science and Technology; Richard Hall, Missouri University of Science and Technology; Hong Sheng, Missouri University of Science and Technology; Ronaldo Luna, Missouri University of Science and Technology