Megan Miller, Montana State University; Chung-Hsuan Benjamin Huang, Department of Electrical and Computer Engineering, Montana State University; Tariq Akmal, Washington State University; Ryan Anderson, Montana State University; Phillip Himmer, Montanta State University, ECE Dept., Montana Microfabrication Facility
Lei Miao, Middle Tennessee State University; Jamshid E Farzidayeri, Middle Tennessee State University; Walter Boles; Ahad S. Nasab P.E., Middle Tennessee State University
Kathryn Jablokow, Pennsylvania State University; Jack V. Matson, Pennsylvania State University, University Park; Darrell Velegol, Pennsylvania State University, University Park
Lulu Sun, Embry-Riddle Aeronautical Univ., Daytona Beach; Cassandra Gribbins, Embry-Riddle Aeronautical University; Ian T. Ferguson, University of North Carolina, Charlotte
Robert L. Nagel, James Madison University; Eric C. Pappas, James Madison University; Gretchen Anne Hazard, James Madison University; Matthew Swain, James Madison University
Gregory Bucks, Purdue University; William Oakes, Purdue University; Carla Zoltowski, Purdue University; Frank DeRego, Purdue University; Silvia Mah, University of California-San Diego