Min-Sung Koh, Eastern Washington University; Esteban Rodriguez-Marek, Eastern Washington University; Claudio Talarico, Eastern Washington University; David Freiberger, Eastern Washington University
James Friauf, Milwaukee School of Engineering; Stephen Williams, Milwaukee School of Engineering; Steven Reyer, Milwaukee School of Engineering; Owe Petersen, Milwaukee School of Engineering
Jin-Hwan Lee, University of Cincinnati; Ali Asgar Bhagat, University of Cincinnati; Karen Davis, University of Cincinnati; Ian Papautsky, University of Cincinnati
J. Scott Hawker, Rochester Institute of Technology; Ian Webber, Rochester Institute of Technology; Michael Starenko, Rochester Institute of Technology; Jeremiah Parry-Hill, Rochester Institute of Technology
Judy Cezeaux, Western New England College; Thomas Keyser, Western New England College; Eric Haffner, Western New England College; Anne Kaboray, Goodwill Industries of the Springfield/Hartford Area, Inc.; Carol Hasenjager, Goodwill Industries of the Springfield/Hartford Area, Inc.
Jeffrey Johnson, University of Cincinnati / Engineering; Mary Beth Privitera, University of Cincinnati; Daria Narmoneva, University of Cincinnati; Balakrishna Haridas, University of Cincinnati