Lisa Frehill; Amanda Lain, New Mexico State University; Ricardo Jacquez, New Mexico State University; Lauren Ketcham, New Mexico State University; Karen Luces, New Mexico State University
Lisa Benson, Clemson University; Sherrill Biggers, Clemson University; William Moss, Clemson University; Matthew Ohland, Purdue Engineering Education; Marisa Orr, Clemson University; Scott Schiff, Clemson University
John Lee, San Jose State University; Stacy Gleixner, San Jose State University; Tai-Ran Hsu, San Jose State University; David Parent, San Jose State University
Amir Rezaei, California State Polytechnic University-Pomona; Mariappan Jawaharlal, California State Polytechnic University-Pomona; Kyu-Jung Kim, California State Polytechnic University-Pomona; Angela Shih, California State Polytechnic University-Pomona
Karen Wosczyna-Birch, CT College of Technology; Lauren Kaufman, CT Business and Industry Association; Mary deManbey, CT Business and Industry Association; Kerry Simoneau, CT College of Technology's Regional Center for Next Generation Manufacturng
Karen Crosby, Southern University; Samuel Ibekwe, Southern University; Guoqiang Li, Southern University; Su-Seng Pang, Louisiana State University-Baton Rouge; Kun Lian, Center for Advanced Microstructures and Devices (CAMD)