Portland, Oregon
June 23, 2024
June 23, 2024
June 26, 2024
NSF Grantees Poster Session
8
10.18260/1-2--46869
https://peer.asee.org/46869
52
Haniye Mehraban obtained her Master of Science degree in Electrical Engineering from K.N. Toosi University of Technology, Tehran, Iran, in 2017. Currently, she is a Ph.D. student in Electrical Engineering at Oklahoma State University, Stillwater, OK, USA. Her research interests are primarily focused on Analog Integrated Circuit Design.
John Hu received his B.S. in Electronics and Information Engineering from Beihang University, Beijing, China, in 2006 and his M.S. and Ph.D. in electrical and computer engineering from the Ohio State University, Columbus, OH, in 2007 and 2010, respectively. He worked as an analog IC designer at Texas Instruments, Dallas, between 2011 and 2012. He was a Member of Technical Staff, IC Design at Maxim Integrated, San Diego, CA, between 2012 and 2016, and a Staff Engineer at Qualcomm, Tempe, AZ, between 2016 and 2019. In 2019, he joined the School of Electrical and Computer Engineering at Oklahoma State University, where he is currently an assistant professor and Jack H. Graham Endowed Fellow of Engineering. His research interests include power management IC design, hardware security, and energy-efficient computing.
With the passage of the Chips and Science Act, semiconductor workforce development has become front and center for US universities. Among the many skills needed for undergraduates to enter the semiconductor industry, debugging is an important skill that is rarely taught. As the transistor count and complexity of today’s chips grow, thanks to Moore’s Law, fewer new chips can work perfectly for the first time. Hence, much engineering effort is put into debugging, a process that identifies and fixes any discrepancies between the expected and measured chip behavior.
This paper first investigates the need and the economic incentives of debugging in the semiconductor industry. It was estimated that a typical semiconductor project spent 35 to 50 percent of its time in debugging. The need for silicon debugging has led to a new profession called validation engineers. Debugging has also gained the nickname of the Schedule Killer, highlighting its impact on the project schedule and the company’s bottom line.
Next, the paper summarizes existing cognitive models of troubleshooting. Early models often failed to capture the role of experience, which was essential for circuit and hardware debugging. Jonassen et al. proposed a troubleshooting learning architecture that includes the contribution of past experiences. This cognitive framework has been successfully applied in computer science and physics education, leading to some of the latest pedagogy innovations, such as collaborative pair debugging.
This paper also investigates multiple emotions associated with debugging, such as frustration, fear, and anxiety. These emotions may lead to disengagement and avoidance of the subjects. Debugging may also be related to other non-cognitive factors, such as mindsets. The positive effect of teaching self-theory and a growth mindset has been observed in different age groups. However, studies also found that domain-specific aptitudes were more helpful in changing student’s performance in the subject matter.
The takeaway message from this paper is that a genuinely effective debugging education intervention must be holistic and domain-specific. Holistic means that the intervention should address both cognitive and affective components. Domain specificity means that any growth mindset message should be contextually situated within the subject matter materials.
How to design such an intervention will be the next million-dollar question, as it not only fills the gap of collegiate debug education in microelectronics but also serves as a critical missing piece toward developing a globally competent semiconductor workforce for generations to come.
Mehraban, H., & Hu, J. (2024, June), Board 293: How to Teach Debugging? The Next Million-Dollar Question in Microelectronics Education Paper presented at 2024 ASEE Annual Conference & Exposition, Portland, Oregon. 10.18260/1-2--46869
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