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Integrating Micro And Nanoscale Matarials Processing Into The Core Che Curriculum Examples In Radiation Heat Transfer

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Conference

2005 Annual Conference

Location

Portland, Oregon

Publication Date

June 12, 2005

Start Date

June 12, 2005

End Date

June 15, 2005

ISSN

2153-5965

Conference Session

Innovative Topics in ChE Curriculum

Page Count

16

Page Numbers

10.790.1 - 10.790.16

Permanent URL

https://peer.asee.org/14324

Download Count

8

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Paper Authors

author page

Milo Koretsky

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Abstract
NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Integrating Micro and Nanoscale Materials Processing into the Core ChE Curriculum - Examples in Radiation Heat Transfer

Milo D. Koretsky

Department of Chemical Engineering Oregon State University Corvallis, OR 97331-2702

Introduction The chemical engineering department at Oregon State University (OSU) is committed to developing strength in microelectronics processing within a context of the fundamental skills of the discipline. In this vein, we are integrating examples from this industry into the classroom and the laboratory.1 These topics are not only useful towards the microelectronics industry but also in the emerging field of nanoscale materials processing. The lab modules, which provide students with hands-on learning as well as more open-ended problem solving experiences, are described elsewhere.1,2 Another important component to this approach is providing students applications in the context of their core ChE engineering science classes. The classroom examples provide students an integrated experience throughout their undergraduate studies and allow students to synthesize chemical engineering science fundamentals applied toward microelectronics and nanomaterials processes. In this paper, two such examples are presented to illustrate how unit operations from microelectronics processes are integrated into a core engineering science class: (i) substrate heating during sputtering and (ii) estimation of maximum pull rates during Czochralski growth. These examples involve radiation heat transfer and can be applied to a transport phenomena (heat transfer) class. Similar examples are being introduced in material and energy balances, fluids, mass transfer, thermodynamics and chemical reaction engineering. The objective of this paper is to demonstrate how these “non traditional” examples have been incorporated as core ChE engineering science topics at OSU, and provide two examples which can be used in a transport phenomena / heat transfer class.

Hundreds of individual process steps are used in the manufacture of even simple microelectronics devices. However, the fabrication sequence uses many of the same unit operations numerous times. These unit operations rely on core chemical engineering science. Modules of many unit operations have been developed for integration into the chemical engineering curriculum and unit operations laboratory at OSU. In addition to the processes discussed in this paper, these modules include: plasma etching. chemical vapor deposition, spin coating, electrochemical deposition, silicon oxidation, and chemical mechanical planarization.1 Such unit operations contain complex systems that involve the interaction of many physical and chemical processes. However, when these unit operations are covered at the university, they are often taught in survey courses and approached descriptively and phenomenologically. An

Proceedings of the 2005 American Society for Engineering Education Annual Conference & Exposition Copyright © 2005, American Society for Engineering Education

Koretsky, M. (2005, June), Integrating Micro And Nanoscale Matarials Processing Into The Core Che Curriculum Examples In Radiation Heat Transfer Paper presented at 2005 Annual Conference, Portland, Oregon. https://peer.asee.org/14324

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