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Student Perspectives On International Collaborations In Engineering And Technology

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Conference

2006 Annual Conference & Exposition

Location

Chicago, Illinois

Publication Date

June 18, 2006

Start Date

June 18, 2006

End Date

June 21, 2006

ISSN

2153-5965

Conference Session

Preparing Engr Students for International Practice

Tagged Division

International

Page Count

3

Page Numbers

11.1165.1 - 11.1165.3

DOI

10.18260/1-2--1362

Permanent URL

https://strategy.asee.org/1362

Download Count

119

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Paper Authors

author page

Michael Ring Dublin Institute of Technology

author page

Michael Dyrenfurth Purdue University

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Abstract
NOTE: The first page of text has been automatically extracted and included below in lieu of an abstract

Student Perspectives on International Exchange/Collaborations

Student A Student B Mechanical Engineering Technology Manufacturing Engineering College of Technology School of Manufacturing Engineering & Design Purdue University Dublin Institute of Technology

Introduction

Reasons for Participation • Gain perspective of other country approaches • Increase understanding of international dynamics • Become more competitive • Potentially identify overseas internship • Have fun

Realities of International Exchange/Collaborations • Travel funding is tight • How do I handle my other classes • Securing visas & passports • Where will I stay • Will this count towards my degree • How do I communicate & plan in advance • Maintaining contact with family • Trepidation of first time overseas…

Similarities and Differences within the institutions and courses • Content Covered • Types of activities • Theory—Application Balance • Lecture/presentation styles • Assessment differences

Student Differences & Similarities • Motivation • Expectations • Perceptions • Preparation

Challenges for Exchanging Students • Timing • Funding • Covering other classes • Language capabilities • Securing housing

Ring, M., & Dyrenfurth, M. (2006, June), Student Perspectives On International Collaborations In Engineering And Technology Paper presented at 2006 Annual Conference & Exposition, Chicago, Illinois. 10.18260/1-2--1362

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