June 24, 2017
June 24, 2017
June 28, 2017
Every material, part, component, device, and system has surfaces and interfaces. The surface and interface properties (e.g., roughness, structure, optical reflection, emissivity, and cleanliness) often play a crucial role in the performance of materials, devices, and systems. Despite its practical importance, surface characterization is a comparatively neglected subject in engineering curricula. Machined metals, 3D-printed plastics, and semiconductor materials for solar cells in various stages of production provide interesting and informative case studies for surface characterization. We have developed a suite of laboratory modules for surface characterization using stylus profilometry, depth gauge measurements, laser and LED light scattering, image processing, thermal imaging with infrared cameras, atomic force microscopy, and white light interferometry. Students learn the metrology and parameterization of surfaces, the techniques to measure and characterize surfaces, the advantages and disadvantages of various methods with regard to accuracy, information content, cost, time, contact vs non-contact, and localized vs global measurements, and how to determine best methods for research, process development, prototyping, and quality assurance.
Mauk, M. G., & Chiou, R., & Kadapa, S., & Tseng, T. B. (2017, June), Surface Characterization in Engineering Curricula Paper presented at 2017 ASEE Annual Conference & Exposition, Columbus, Ohio. https://peer.asee.org/28890
ASEE holds the copyright on this document. It may be read by the public free of charge. Authors may archive their work on personal websites or in institutional repositories with the following citation: © 2017 American Society for Engineering Education. Other scholars may excerpt or quote from these materials with the same citation. When excerpting or quoting from Conference Proceedings, authors should, in addition to noting the ASEE copyright, list all the original authors and their institutions and name the host city of the conference. - Last updated April 1, 2015