Surface Characterization in Engineering Curricula
- Conference
- Location
-
Columbus, Ohio
- Publication Date
-
June 24, 2017
- Start Date
-
June 24, 2017
- End Date
-
June 28, 2017
- Conference Session
- Tagged Division
-
Manufacturing
- Page Count
-
17
- DOI
-
10.18260/1-2--28890
- Permanent URL
-
https://peer.asee.org/28890
- Download Count
-
463
Paper Authors
Michael G. Mauk Drexel University
Michael Mauk is Assistant Professor in Drexel University's Engineering Technology program.
Richard Chiou Drexel University (Eng. & Eng. Tech.)
Dr. Richard Chiou is Associate Professor within the Engineering Technology Department at Drexel University, Philadelphia, USA. He received his Ph.D. degree in the G.W. Woodruff School of Mechanical Engineering at Georgia Institute of Technology. His educational background is in manufacturing with an emphasis on mechatronics. In addition to his many years of industrial experience, he has taught many different engineering and technology courses at undergraduate and graduate levels. His tremendous research experience in manufacturing includes environmentally conscious manufacturing, Internet based robotics, and Web based quality. In the past years, he has been involved in sustainable manufacturing for maximizing energy and material recovery while minimizing environmental impact.
Shraman Kadapa Drexel University (Eng. & Eng. Tech.)
Shraman Kadapa completed his bachelor's degree in mechanical engineering from Purdue University, West Lafayette. He is currently pursuing a masters' degree in mechanical engineering and mechanics at Drexel University. He is a research and teaching assistant in the mechanical and mechatronics lab at Drexel. He is also a researcher in Scalable Autonomous Systems Lab. His research interests are mainly in robotics which include motion planning and localization of ground robots.
Tzu-Liang Bill Tseng University of Texas, El Paso
Dr. Tseng is a Professor and Chair of Industrial, Manufacturing and Systems Engineering at UTEP. His research focuses on the computational intelligence, data mining, bio- informatics and advanced manufacturing. Dr. Tseng published in many refereed journals such as IEEE Transactions, IIE Transaction, Journal of Manufacturing Systems and others. He has been serving as a principle investigator of many research projects, funded by NSF, NASA, DoEd, KSEF and LMC. He is currently serving as an editor of Journal of Computer Standards & Interfaces.
Abstract
Every material, part, component, device, and system has surfaces and interfaces. The surface and interface properties (e.g., roughness, structure, optical reflection, emissivity, and cleanliness) often play a crucial role in the performance of materials, devices, and systems. Despite its practical importance, surface characterization is a comparatively neglected subject in engineering curricula. Machined metals, 3D-printed plastics, and semiconductor materials for solar cells in various stages of production provide interesting and informative case studies for surface characterization. We have developed a suite of laboratory modules for surface characterization using stylus profilometry, depth gauge measurements, laser and LED light scattering, image processing, thermal imaging with infrared cameras, atomic force microscopy, and white light interferometry. Students learn the metrology and parameterization of surfaces, the techniques to measure and characterize surfaces, the advantages and disadvantages of various methods with regard to accuracy, information content, cost, time, contact vs non-contact, and localized vs global measurements, and how to determine best methods for research, process development, prototyping, and quality assurance.
Mauk, M. G., & Chiou, R., & Kadapa, S., & Tseng, T. B. (2017, June), Surface Characterization in Engineering Curricula Paper presented at 2017 ASEE Annual Conference & Exposition, Columbus, Ohio. 10.18260/1-2--28890
ASEE holds the copyright on this document. It may be read by the public free of charge. Authors may archive their work on personal websites or in institutional repositories with the following citation: © 2017 American Society for Engineering Education. Other scholars may excerpt or quote from these materials with the same citation. When excerpting or quoting from Conference Proceedings, authors should, in addition to noting the ASEE copyright, list all the original authors and their institutions and name the host city of the conference. - Last updated April 1, 2015