June 28, 1998
June 28, 1998
July 1, 1998
3.532.1 - 3.532.9
Teaching Lab Course on Electronic Packaging and Materials
Youngmee Lee Department of Materials Science and Engineering University of Washington, Seattle, WA 98195
Minoru Taya / Thomas Stoebe / Yasuo Kuga, and Mani Soma Department of Mechanical Engineering / Department of Materials Science and Engineering / Department of Electrical Engineering
With support from the National Science Foundation, we have developed a new lab course, Electronic Packaging and Materials, which is jointly offered by the Departments of Mechanical Engineering, Materials Science and Engineering, and Electrical Engineering. The lab project consists of three parts: Lab 1, Dissection of Electronic Packaging; Lab 2, Processing of Electronic Packaging; and Lab 3, Reliability Testing of Electronic Packaging. To complete the three labs, six weeks were required; one week for Lab 1, three weeks for Lab 2, and two weeks for Lab 3. Students were able to gain a good understanding on the electronic packaging. Future improvements planned for the course include expansion of the lab subjects, adding more experimental equipment, and establishing a closer correlation between the lectures and lab sessions.
The lab course on Electronic Packaging and Materials (EPM) is the part of a program to establish a comprehensive electronic packaging program at the University of Washington sponsored by the National Science Foundation (NSF). A lecture course on EPM has been offered annually since Spring, 1995. However, it was realized that a single course without a lab section could not cover the entire area of EPM. As a first attempt, a new laboratory course was given in Winter, 1998 along with the lecture course.
The new laboratory course as well as the lecture course on EPM were jointly offered by the Departments of Mechanical Engineering (ME), Materials Science and Engineering (MSE) and Electrical Engineering (EE). The target students were undergraduate seniors and first-year graduate students. In total, 21 students took the lab section, 10 from ME and 11 from MSE, but none from EE. All the ME students were undergraduates and 7 out of the 11 from MSE were graduate students. This laboratory offered two sessions, a Tuesday session with 12 students and a Thursday session with 9 students.
The laboratory consisted of three main subjects: Lab 1, Dissection of Electronic Packaging; Lab 2, Processing of Electronic Packaging; and Lab 3, Reliability Testing of Electronic Packaging. The laboratory started in the fourth week of the quarter in order to allow students to obtain a
Lee, Y., & Kuga, Y., & Stoebe, T., & Taya, M., & Soma, M. (1998, June), Teaching Lab Course On Electronic Packaging And Materials Paper presented at 1998 Annual Conference, Seattle, Washington. https://peer.asee.org/7453
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