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Implementing PackML in the Engineering and Technology Curriculum

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Conference

2024 ASEE Annual Conference & Exposition

Location

Portland, Oregon

Publication Date

June 23, 2024

Start Date

June 23, 2024

End Date

July 12, 2024

Conference Session

Hands-On Learning in ET II

Tagged Division

Engineering Technology Division (ETD)

Permanent URL

https://peer.asee.org/47583

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Paper Authors

biography

Maged Mikhail Purdue University Northwest

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Dr. Maged B.Mikhail, Assistant Professor, Mechatronics Engineering Technology Ph.D., Electrical Engineering,
Tennessee State University, Nashville, Tennessee, August 2013. Dissertation title: ”Development
of Integrated Decision Fusion Software System

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Abstract

PackML (Packaging Machine Language) is an automation standard widely adopted within the packaging industry to establish standardized control protocols for packaging machinery. Development of the PackML standard was facilitated by the Organization for Machine Automation and Control (OMAC), garnering substantial recognition across the packaging sector. The integration of PackML has yielded notable benefits, including heightened operational efficiency, cost reduction, and increased machine adaptability. The paper explores the conceptual foundations of PackML and the practical aspects of its implementation. It highlights four dedicated laboratory exercises created to empower students with hands-on experience in utilizing PackML with modern automation systems. These exercises aid in acquainting students with standardized and contemporary programming processes, often absent from university laboratory environments. Students familiar with industry processes are better positioned to secure higher-paying employment opportunities, thus elevating their professional prospects. These outcomes are a direct result of the ongoing collaboration between the author and OMAC, driven by a shared commitment to promote the adoption of PackML within academic settings.

Mikhail, M. (2024, June), Implementing PackML in the Engineering and Technology Curriculum Paper presented at 2024 ASEE Annual Conference & Exposition, Portland, Oregon. https://peer.asee.org/47583

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