Designing Opportunities for Youth Engagement in STEM
Collection
2019 ASEE Annual Conference & Exposition
Authors
Yanjun Yan, Western Carolina University; Mary Anna LaFratta, Western Carolina University; Hugh Jack P. Eng. P.E., Western Carolina University; Lane Graves Perry III, Western Carolina University
Designing Opportunities for Youth Engagement in STEM
Collection
2019 ASEE Annual Conference & Exposition
Authors
Oscar Matias Gonzalez Chamorro, Proyecto Arapy; Gustavo Ramón Samaniego Balbuena, Colegio Inmaculada Concepción; Jorge H. Kurita, Universidad Nacional de Asuncion
Designing Opportunities for Youth Engagement in STEM
Collection
2019 ASEE Annual Conference & Exposition
Authors
Molly Y. Mollica, University of Washington; Alyssa M. Spomer, University of Washington ; Brianna M. Goodwin, University of Washington; Shawn Israel, University of Washington, Departmet of Rehabilitation Medicine; Anat Caspi P.E., University of Washington; Heather A Feldner, University of Washington Department of Rehabilitation Medicine; Katherine M. Steele, University of Washington; Dianne Grayce Hendricks, University of Washington
Chris San Antonio-Tunis, Museum of Science, Boston; Joelle Clark, Northern Arizona University; Christine M. Cunningham, Museum of Science, Boston; Cathy P. Lachapelle, Museum of Science, Boston
Nena E. Bloom, Northern Arizona University; Elisabeth Roberts, Northern Arizona University; Lori Rubino-Hare, Northern Arizona University; Haylee Nichole Archer, Northern Arizona University; Christine M. Cunningham, Museum of Science, Boston; Joelle Clark, Northern Arizona University
Kristen Booth, North Carolina State University; Megan Patberg Morin, North Carolina State University; Alireza Dayerizadeh, North Carolina State University; Pam Page Carpenter, North Carolina State University
Engineering Professional Development using Robotics Activities
Collection
2019 ASEE Annual Conference & Exposition
Authors
Abhidipta Mallik, NYU Tandon School of Engineering; Sheila Borges Rajguru, NYU Tandon School of Engineering; Vikram Kapila, NYU Tandon School of Engineering