Saul E. Crespo, Tecnologico de Monterrey, Mexico; Miguel X. Rodriguez-Paz, Tecnologico de Monterrey, Mexico; Job R. Medina Hernandez, Tecnologico de Monterrey, Mexico; Luis Horacio Hernandez-Carrasco, Tecnologico de Monterrey, Mexico; Milan Sokol, Slovak University of Technology in Bratislava, Slovakia
Miguel X. Rodriguez-Paz, Tecnologico de Monterrey (ITESM); Jorge A. Gonzalez-Mendivil, Tecnológico de Monterrey; Israel Zamora-Hernandez; Martha Elena Nunez, Tecnologico de Monterrey (ITESM)
Samuel Underwood, University of Nebraska - Lincoln; Markeya S. Peteranetz, University of Nebraska - Lincoln; Clarence Waters, University of Nebraska - Lincoln
Luis Horacio Hernandez Carrasco P.E., Tecnologico de Monterrey (ITESM); Miguel X. Rodriguez-Paz, Tecnologico de Monterrey (ITESM); Saul E. Crespo, Tecnologico de Monterrey (ITESM)
Daniel Cartuche; victor R viteri; Miguel Andres Guerra, Universidad San Francisco de Quito USFQ; Homero Murzi, Virginia Polytechnic Institute and State University
Samuel Underwood, University of Nebraska - Lincoln; Markeya S. Peteranetz, University of Nebraska - Lincoln; Clarence Waters, University of Nebraska - Lincoln
Luis Horacio Hernandez Carrasco, Tecnologico de Monterrey (ITESM); Miguel X. Rodriguez-Paz, Tecnologico de Monterrey (ITESM); Saul E. Crespo-Sanchez, Tecnologico de Monterrey (ITESM)
Jose G. Rangel-Ramirez, Tecnologico de Monterrey; Saul E. Crespo, Tecnologico de Monterrey ; Miguel X. Rodriguez-Paz, Tecnologico de Monterrey ; Luis Horacio Hernandez Carrasco P.E., Tecnologico de Monterrey
Luis Horacio Hernandez Carrasco, Tecnologico de Monterrey ; Miguel X. Rodriguez-Paz, Tecnologico de Monterrey ; Saul E. Crespo, Tecnologico de Monterrey