Waterloo Tsutsui, Purdue University at West Lafayette; Ruben D. Lopez-Parra, Purdue University at West Lafayette (COE); Genisson Silva Coutinho, Instituto Federal de Educação, Ciência e Tecnologia da Bahia; Alberto W. Mello, Embry-Riddle Aeronautical University; Michael David Sangid, Purdue University; Tamara J. Moore, Purdue University at West Lafayette
IED Technical Session: Preparing Courses for the Future
Collection
2018 ASEE Annual Conference & Exposition
Authors
Michael Andre Hamilton, Mississippi State University ; Raed Jaradat, Mississippi State University; Parker Jones, Mississippi State University; Emily S. Wall , Mississippi State University; Vidanelage Lakshika Dayarathna, Mississippi State University; Debisree Ray, Mississippi State University ; Ginnie Shih En Hsu
IED Technical Session: Preparing Courses for the Future
Collection
2018 ASEE Annual Conference & Exposition
Authors
John Pickard, East Carolina University; Jimmy Bill Linn; Tolulope B. Awojana, East Carolina University; Philip J. Lunsford II, East Carolina University
Tricks of the Trade - Experiences Designing Courses and Communities
Collection
2016 ASEE Annual Conference & Exposition
Authors
John Phillip Shelley, University of Alabama at Birmingham; Forrest Satterfield, Satterfield Technologies ; Rohit Borah, University Innovation Fellows, The University of Alabama at Birmingham; Murray Dean Ladner III, University of Alabama at Birmingham
Implementing the CE BOK into Courses and Curricula
Collection
2010 Annual Conference & Exposition
Authors
Michael Doran, University of WIsconsin-Madison; Charlie Quagliana, University of WIsconsin-Madison; Norman Doll, University of WIsconsin-Madison; Jeffrey Russell, University of Wisconsin, Madison; Greg Harrington, University of WIsconsin-Madison
Scholar Program Proposal/Develop Courses and Materials/Collaborations and Accredatation Systems for Global Engineering Education / Preparing Engineers for the Global Workplace and Successful Graduates for a Flat World: What Does It Take?
Collection
2010 Annual Conference & Exposition
Authors
Lueny Morell, Hewlett-Packard; Jennifer DeBoer, SPEED