Karla L. Sanchez, Purdue University; Alejandra J. Magana, Purdue University, West Lafayette; David Sederberg, Purdue University; Grant P Richards, Purdue University, West Lafayette; M. Gail Jones, NC State University; Hong Z Tan, Purdue University
Wayne W. Walter, Rochester Institute of Technology (COE); Michael G. Schrlau, Rochester Institute of Technology (COE); Patricia Iglesias, National Technical Institute for the Deaf; Kate N. Leipold, Rochester Institute of Technology (COE); Timothy Aaron Nichols, Rochester Institute of Technology
Ryan R. Goyings, Civil & Mechanical Engineering Department at The United States Military Academy; James Ledlie Klosky, United States Military Academy, West Point; Bobby G Crawford, U.S. Military Academy
Stephen J Krause, Arizona State University; Dale R Baker, Arizona State University; Adam R Carberry, Arizona State University; Milo Koretsky, Oregon State University; Bill Jay Brooks, Oregon State University; Debra Gilbuena, Oregon State University; Cindy Waters, North Carolina A&T State University; Casey Jane Ankeny, Arizona State University
So Yoon Yoon, INSPIRE, Purdue University, West Lafayette; Yi Kong, Purdue University, West Lafayette; Heidi A. Diefes-Dux, Purdue University, West Lafayette; Johannes Strobel, Purdue University, West Lafayette
Study Abroad, International Experience, Exchange Programs and Student Retention
Collection
2013 ASEE Annual Conference & Exposition
Authors
Keilin Tarum Deahl, University of Illinois at Urbana-Champaign; Eileen Walz, University of Illinois; Russell Korte, University of Illinois, Urbana-Champaign; Valeri Werpetinski, University of Illinois, Urbana-Champaign; Laura D Hahn, University of Illinois, Urbana-Champaign; Judith A Sunderman, University of Illinois, Urbana-Champaign; J. Bruce Elliott- Litchfield, University of Illinois, Urbana-Champaign
Stanley W. Hsu, University of California, Davis; Rajeevan Amirtharajah, University of California, Davis; andre knoesen, Department of Electrical and Computer Engineering, U C Davis
Stephen Boedo, Rochester Institute of Technology (COE); Elizabeth A. DeBartolo, Rochester Institute of Technology (COE); Matthew Kasemer, Rochester Institute of Technology
Tolga Kaya, Central Michigan University; Kumar Yelamarthi, Central Michigan University; Brian P DeJong, Central Michigan University; Qin Hu, Central Michigan University; Shaopeng Cheng, Central Michigan University ; Steve Kettler, Alma High School; Daniel Chen, Central Michigan University
Engineering Leadership Development Division Technical Session
Collection
2013 ASEE Annual Conference & Exposition
Authors
Kirsten S. Hochstedt, Penn State University ; Andrew Michael Erdman, Pennsylvania State University; Richard John Schuhmann, Gordon–MIT Engineering Leadership Program
Ronald H Rockland, New Jersey Institute of Technology; Linda Hirsch, New Jersey Institute of Technology; Levelle Burr-Alexander, New Jersey Institute of Technology; John D. Carpinelli, New Jersey Institute of Technology; Howard S. Kimmel, New Jersey Institute of Technology