Megan Miller, Montana State University; Chung-Hsuan Benjamin Huang, Department of Electrical and Computer Engineering, Montana State University; Tariq Akmal, Washington State University; Ryan Anderson, Montana State University; Phillip Himmer, Montanta State University, ECE Dept., Montana Microfabrication Facility
Lei Miao, Middle Tennessee State University; Jamshid E Farzidayeri, Middle Tennessee State University; Walter Boles; Ahad S. Nasab P.E., Middle Tennessee State University
Kathryn Jablokow, Pennsylvania State University; Jack V. Matson, Pennsylvania State University, University Park; Darrell Velegol, Pennsylvania State University, University Park
Lulu Sun, Embry-Riddle Aeronautical Univ., Daytona Beach; Cassandra Gribbins, Embry-Riddle Aeronautical University; Ian T. Ferguson, University of North Carolina, Charlotte
Robert L. Nagel, James Madison University; Eric C. Pappas, James Madison University; Gretchen Anne Hazard, James Madison University; Matthew Swain, James Madison University
Jeffrey Stransky, Rowan University; Caleb Hill; Robert John McErlean, Rowan University; Jacob Willetts, Rowan University; Landon Bassett, University of Connecticut; Daniel D. Anastasio, Rose-Hulman Institute of Technology; Daniel D. Burkey, University of Connecticut; Matthew Cooper, North Carolina State University at Raleigh; Cheryl A. Bodnar, Rowan University
Susan M. Stagg-Williams, The University of Kansas; Molly McVey, The University of Kansas; Andrew David Yancey, The University of Kansas; Akash Anand, The University of Kansas; Arthur A. Lee, The University of Kansas
Heather C. S. Chenette, Rose-Hulman Institute of Technology; Daniel D. Anastasio, Rose-Hulman Institute of Technology; Gregory T. Neumann, Rose-Hulman Institute of Technology
David Olawale, R.B. Annis School of Engineering, University of Indianapolis; Payton Ashby Staman, University of Indianapolis; James T Emery II, University of Indianapolis
Gurcan Comert; Zulfikar Berk, University of South Carolina; Robert Petrulis; Balaji Iyangar; Esmail M Abuhdima, Benedict college; Negash Begashaw, Benedict College
Abdussalam Alawini, University of Illinois at Urbana-Champaign; Peilin Rao, UIUC; Leyao Zhou, University of Illinois at Urbana-Champaign; Lujia Kang; PING-CHE HO, PureStorage