Afsaneh Minaie, Utah Valley University; Ali Sanati-Mehrizy, Pennsylvania State University; Paymon Sanati-Mehrizy, University of Pennsylvania; Reza Sanati-Mehrizy, Utah Valley University
Afsaneh Minaie, Utah Valley University; Ali Sanati-Mehrizy, Pennsylvania State University; Paymon Sanati-Mehrizy, University of Pennsylvania; Reza Sanati-Mehrizy, Utah Valley University
Abby M Kelly, University of Washington; Evan T. Curtis, Univeristy of Nebraska, Lincoln; Johnathan Ian Edward McCoy, University of Nebraska, Lincoln; Dennis D. Schulte P.E., University of Nebraska, Lincoln; David Jones, University of Nebraska, Lincoln
Janet Y. Tsai, University of Colorado, Boulder; Daria A. Kotys-Schwartz, University of Colorado, Boulder; Beverly Louie, University of Colorado, Boulder; Virginia Lea Ferguson, University of Colorado; Alyssa Nicole Berg, University of Colorado, Boulder
Nicholas Charles Cappello, York College of Pennsylvania; Takeshi Jonathan Ei, York College of Pennsylvania; Edward Miller Jr., York College of Pennsylvania; Dan Bosse, Weldon Solutions; Berne S. Edwards, Graham Packaging Company; Kala Meah, York College of Pennsylvania; Stephen N. Kuchnicki, York College of Pennsylvania; Gregory M. Link, York College of Pennsylvania; Wayne Blanding, York College of Pennsylvania; Scott F. Kiefer, York College of Pennsylvania
Noe Vargas Hernandez, University of Texas, El Paso; Jose Gabriel Davila, University of Texas, El Paso; Jorge Garza-Ulloa, University of Texas, El Paso; Pablo Rangel, University of Texas, El Paso; Julio Adrian Torres
Megan F. Campanile, Illinois Institute of Technology; Eric M. Brey, Illinois Institute of Technology; Allison Antink Meyer, Illinois Institute of Technology; Norman G. Lederman, Illinois Institute of Technology
Bill Jay Brooks, Oregon State University; Debra Gilbuena, Oregon State University; John L. Falconer, University of Colorado, Boulder; David L. Silverstein, University of Kentucky; Ronald L. Miller, Colorado School of Mines; Milo Koretsky, Oregon State University
Wayne Weaver, Michigan Technological University; Jeremy John Worm P.E., Michigan Technological University; Jeffrey D. Naber, Michigan Technological University; Leonard J. Bohmann, Michigan Technological University; John E. Beard, Michigan Technological University; Carl L. Anderson, Michigan Technological University; Bo Chen, Michigan Technological University; Jason M. Keith, Mississippi State University
Andy Shaojin Zhang, New York City College of Technology; Farrukh Zia, New York City College of Technology; Iem H. Heng, New York City College of Technology; Sidi Berri, New York City College of Technology