Nicholas Charles Cappello, York College of Pennsylvania; Takeshi Jonathan Ei, York College of Pennsylvania; Edward Miller Jr., York College of Pennsylvania; Dan Bosse, Weldon Solutions; Berne S. Edwards, Graham Packaging Company; Kala Meah, York College of Pennsylvania; Stephen N. Kuchnicki, York College of Pennsylvania; Gregory M. Link, York College of Pennsylvania; Wayne Blanding, York College of Pennsylvania; Scott F. Kiefer, York College of Pennsylvania
Noe Vargas Hernandez, University of Texas, El Paso; Jose Gabriel Davila, University of Texas, El Paso; Jorge Garza-Ulloa, University of Texas, El Paso; Pablo Rangel, University of Texas, El Paso; Julio Adrian Torres
Oscar Nespoli, University of Waterloo; William Owen, University of Waterloo; Colin Campbell, University of Waterloo; Steve Lambert, University of Waterloo
Katie Cadwell, University of Wisconsin, Madison; Greta Zenner, University of Wisconsin, Madison; Naomi Chesler, University of Wisconsin, Madison; Wendy Crone, University of Wisconsin, Madison
William DeLuca, North Carolina State University; Nasim Lari, North Carolina State University; Jeremy V Ernst, North Carolina State University; Aaron C. Clark, North Carolina State University
Daniel P. Kelly, Texas Tech University; Jeremy V. Ernst, Embry-Riddle Aeronautical University; Aaron C. Clark, North Carolina State University at Raleigh; Erik Schettig, North Carolina State University at Raleigh
Tiffany Wenting Li, University of Illinois at Urbana-Champaign; Ziang Xiao, University of Illinois at Urbana-Champaign; Molly H. Goldstein, University of Illinois at Urbana - Champaign; Michael L. Philpott PhD., University of Illinois at Urbana - Champaign; Brian Woodard, University of Illinois at Urbana - Champaign