Women in Engineering Division (WIED) Technical Session 6
Collection
2023 ASEE Annual Conference & Exposition
Authors
Andrea E. Surovek, South Dakota School of Mines and Technology; Brooke Lamonte Long-Fox, South Dakota School of Mines & Technology; Arley Williams, South Dakota School of Mines and Technology; Lisa A. Kunza; Sara Elizabeth Racz
Women in Engineering Division (WIED) Technical Session 7
Collection
2023 ASEE Annual Conference & Exposition
Authors
Karen Watkins-Lewis, Morgan State University; Heather Dillon, University of Washington; Rebecca N. Sliger, Tacoma Community College; Bonnie J. Becker; Erica Cline; Cheryl Greengrove; Petronella A. James, Morgan State University; Angela Edes Kitali; Adrienne Scarcella
Design in Engineering Education Division (DEED) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Yun Wang, Undergraduate at University of Illinois Urbana-Champaign; Colin P. Lualdi, University of Illinois Urbana-Champaign; Lawrence Angrave, University of Illinois Urbana-Champaign; Guru Nanma Purushotam
Jennifer Kouo, The Institute for Innovation in Development, Engagement, and Learning Systems (IDEALS) at the Johns Hopkins University School of Education; Jeannie Chipps, Johns Hopkins University; Rachel Figard, Arizona State University; Kenneth Reid, University of Indianapolis; Katey Shirey, eduKatey LLC, STEAM Education Services; Stacy S. Klein-Gardner, Vanderbilt University
Kelli Paul, Indiana University-Bloomington; Jungsun Kim, Indiana University-Bloomington; Lauren Penney, Indiana University-Bloomington; Amber Simpson, State University of New York at Binghamton; Adam Maltese, Indiana University-Bloomington
Allison Antink-Meyer, Illinois State University; Matthew Aldeman, Illinois State University; Jin Ho Jo; Jeritt Williams, Illinois State University; Maria Luisa Zamudio
Jiahui Song, Wentworth Institute of Technology; Gloria Guohua Ma, Wentworth Institute of Technology; Douglas Eric Dow, Wentworth Institute of Technology; James R. McCusker Ph.D., Wentworth Institute of Technology; Suzanne Sontgerath, Wentworth Institute of Technology; Ilie Talpasanu
Jeffrey D. Radloff, SUNY Cortland; Allison Antink-Meyer, Illinois State University; Ryan Brown, Illinois State University; Ibrahim H. Yeter, Nanyang Technological University; Dominick Fantacone