Lisa Huettel, Duke University; Kip Coonley, Duke University; Michael Gustafson, Duke University; Jungsang Kim, Duke University; Gary Ybarra, Duke University; Leslie Collins, Duke University
Douglas Williams, Georgia Institute of Technology; Robert Butera, Georgia Institute of Technology; Selcuk Uluagac, Georgia Institute of Technology; Matthew Clark, Georgia Institute of Technology; Andy Deck, National Instruments; Michael Torba, National Instruments; Steven Trahan, National Instruments
James Friauf, Milwaukee School of Engineering; Stephen Williams, Milwaukee School of Engineering; Steven Reyer, Milwaukee School of Engineering; Owe Petersen, Milwaukee School of Engineering
Jin-Hwan Lee, University of Cincinnati; Ali Asgar Bhagat, University of Cincinnati; Karen Davis, University of Cincinnati; Ian Papautsky, University of Cincinnati
Mihaela Radu, Rose-Hulman Institute of Technology; Clint Cole, Washington State University, Pullman; Mircea Alexandru Dabacan, Technical University of Cluj-Napoca, Romania; Shannon Sexton, Rose Hulman Institute of Technology
Mihaela Radu, Rose-Hulman Institute of Technology; Clint COLE, Washington State University, Pullman; Mircea Dabacan, Technical University of Cluj Napoca, Romania; Joe Harris, DigilentInc; Albert Fazekas, Technical University of Cluj Napoca, Romania; Ioana DABACAN, Technical University of Cluj Napoca, Romania
Randal Abler, Georgia Tech; James Krogmeier, Purdue University; Aaron Ault, Purdue University; Julia Melkers, Georgia Institute of Technology; Tamara Clegg, Georgia Institute of Technology; Edward Coyle, Georgia Institute of Technology
Yi Cheng, California State Polytechnic University-Pomona; Kathleen Hayden, California State Polytechnic University-Pomona; Zekeriya Aliyazicioglu, California State Polytechnic University-Pomona
James Shey, United States Naval Academy; Ryan Rakvic, United States Naval Academy; Thomas Salem, United States Naval Academy; Samara Firebaugh, United States Naval Academy