Patricia F. Mead, Norfolk State University; Gwen Lee-Thomas, Quality Measures, LLC; Abe Eftekhari, Northern Virginia Community College; Ji Hyon Mun, Thomas Nelson Community College
Angela Minichiello, Utah State University; Tracy D Blake, Utah State University; Wade H. Goodridge, Utah State University; David Dwight Sam PhD, Utah State University
Elizabeth T. Cady, National Academy of Engineering; Norman L. Fortenberry, American Society for Engineering Education; Catherine Didion, National Academy of Engineering
Lois Calian Trautvetter, Northwestern University; Rose M. Marra, University of Missouri, Columbia; Lisa R. Lattuca, Pennsylvania State University, University Park; Katie L. Piacentini, University of Missouri - Columbia; David B. Knight, Pennsylvania State University, University Park
Anna M. Zajicek, University of Arkansas; Shauna A. Morimoto, University of Arkansas; Aparna S. Terdalkar, University of Arkansas; Valerie H. Hunt, University of Arkansas; Joseph J. Rencis, University of Arkansas; Rodica Lisnic, University of Arkansas
Silvia Carreno-Castillo, Universidad de las Américas, Puebla; Aurelio Lopez-Malo, Universidad de las Américas, Puebla; Enrique Palou, Universidad de las Américas, Puebla
Matthew J Miller, University of Maryland; Robert Lent, University of Maryland, College Park; Paige E Smith, University of Maryland, College Park; Bevlee A. Watford, Virginia Tech; Gregory M. Wilkins, Morgan State University; Matthew M. Jezzi, University of Maryland; Kayi Hui, University of Maryland, College Park; Robert H Lim, University of Maryland, College Park; Nicole A Bryan, University of Maryland, College Park; Helena Mimi Martin, University of Maryland, College Park
Globalizing Engineering Education II: Best Practices
Collection
2011 ASEE Annual Conference & Exposition
Authors
Aurenice Menezes Oliveira, Michigan Technological University; Ivan T Lima Jr., Department of Electrical and Computer Engineering, North Dakota State University
Santosh Devasia, University of Washington; Jim L. Borgford-Parnell, University of Washington; Jae-Hyun Chung, University of Washington; Jiangyu Li, University of Washington; Amy Shen, University of Washington; Nathan Sniadecki, University of Washington; Junlan Wang, University of Washington
Marissa Jablonski, University of Wisconsin, Milwaukee; John R. Reisel, University of Wisconsin, Milwaukee; Hossein Hosseini, University of Wisconsin, Milwaukee; Ethan V Munson, University of Wisconsin, Milwaukee; Leah Rineck
Tom Weller, University of South Florida; Jeff Frolik, University of Vermont; Paul G. Flikkema, Northern Arizona University; Wayne A. Shiroma, University of Hawaii at Manoa; Carol Haden, Magnolia Consulting, LLC; Rhonda R. Franklin, Univeristy of Minnesota
J. Neubert, University of North Dakota; Deborah Worley, University of North Dakota; Naima Kaabouch, Electrical Engineering Department, University of North Dakota
James Boerio, University of Cincinnati; Dionysios D. Dionysiou, University of Cincinnati; Ian Papautsky, University of Cincinnati; Miguel Pelaez, University of Cincinnati; Mark Schulz; Christopher Huth; Vesselin N. Shanov, University of Cincinnati; Donglu Shi, University of Cincinnati